What Transformation Has the 3D IC And 2.5D IC Packaging Market Undergone?
The 3d ic and 2.5d ic packaging market has seen considerable growth due to a variety of factors.
•In recent years, there has been a significant expansion in the market size of 3D IC and 2.5D IC packaging. The market, which is predicted to escalate from $53.51 billion in 2024 to $59.28 billion in 2025 will experience a compound annual growth rate (CAGR) of 10.8%.
The substantial growth in the historical period can be linked to factors such as the miniaturization of electronic appliances, the quest for better power efficiency, the need for improved signal integrity, an increase in the demand for consumer electronics and gaming devices, and performance enhancement.
How Will The 3D IC And 2.5D IC Packaging Market Size Evolve In The Foreseeable Future?
The 3d ic and 2.5d ic packaging market is expected to maintain its strong growth trajectory in upcoming years.
• The market size of 3D IC And 2.5D IC packaging is set to experience substantial expansion in the coming years, with projections estimating a rise to $88.9 billion in 2029, marking a compound annual growth rate (CAGR) of 10.7%.
Several factors will fuel this growth during the forecast period including the rise of wearable and portable devices, an increasing emphasis on energy efficiency, the expanding demand for high-performance computing (HPC), the shift towards system-on-chip (SoC) designs, the growing intricacy of semiconductor devices, and the proliferation of IoT. Notable trends expected to shape the forecast period encompass advancements in 5G technology, the development of advanced interconnect technologies, industry collaboration and standardization, technological advances in semiconductor technology, and innovation in packaging materials.
Which Key Drivers Are Propelling The 3D IC And 2.5D IC Packaging Market's Growth?
The expansion of the 3D IC And 2.5D IC packaging market is projected to be fueled by the rising demand for consumer electronics. Consumer electronics comprise all electronic devices designed for consumer or end user purchase and use for personal, everyday, and non-business purposes. 3D IC (Integrated Circuit) and 2.5D IC packaging, cutting-edge packaging technologies, provide augmented performance, improved functionality, and enable the miniaturization of electronic gadgets. The mounting demand for consumer electronics and gaming equipment can be attributed to technological progression, increased disposable income, expansion of the gaming sector, digital transformation, remote working and entertainment trends, evolving lifestyle and preferences, and the impact of social media and content consumption. For example, as per the 2022 annual financial report of LG, a consumer electronics firm based in South Korea, there was a 12.9% growth from the previous year in 2022 sales, which surpassed roughly $52.70 billion. Moreover, the LG Home Appliance & Air Solution Company also reported record-breaking revenue of $22.5 billion in 2022, up by 10.3% from the previous year. Thus, the escalating demand for consumer electronics is catalyzing the growth of the 3D IC And 2.5D IC packaging market.
What Are The Key Segments Within The Global 3D IC And 2.5D IC Packaging Market?
The 3D IC and 2.5D IC packaging market covered in this report is segmented –
1) By Technology: 3D Wafer-Level Chip-Scale Packaging, 3D TSV (Through-Silicon Via), 2.5D
2) By Application: Logic, Memory, Imaging And Optoelectronics, MEMS Or Sensors, LED, Other Applications
3) By End-User: Telecommunication, Consumer Electronics, Automotive, Military And Aerospace, Medical Devices, Smart Technologies, Other End Users
Subsegments:
1) By 3D Wafer-Level Chip-Scale Packaging (WLCSP): Direct Chip Attach, Wafer-Level Packaging (WLP)
2) By 3D TSV (Through-Silicon Via): Interposer-Based TSV, Stacked Die TSV
3) By 2.5D: Active Interposers
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How Are New Trends Impacting The Size Of The 3D IC And 2.5D IC Packaging Market?
Cutting-edge technologies are becoming increasingly influential in the 3D IC And 2.5D IC packaging market, a key development well-recognized among leading enterprises in the sector. These firms are integrating new technological applications in their operations to maintain their market leadership. For instance, in June 2022, ASE Technology Holding Co. Ltd., a firm based in Taiwan known for its semiconductor manufacturing services, introduced VIPack. VIPack is a highly advanced packaging platform engineered to deliver vertically integrated package solutions. This innovative platform from ASE represents a new generation of 3D heterogeneous integration architecture. It is capable of offering expanded design guidelines while delivering top-performance and increased density. The platform allows companies to exhibit extraordinary creativity in fusing multiple chips into one package, making use of cutting-edge redistribution layer (RDL) technologies, 2.5D and 3D technologies, and embedded integration. ASE’s VIPack is fueled by six principal packaging technological pillars, further supplemented by a comprehensive co-design ecosystem. Included in these pillars are ASE's high-density 2.5D and 3D IC and Co-Packaged Optics processing capabilities through Silicon Via (TSV), as well as technologies based on Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP).
Who Are the Key Players in the 3D IC And 2.5D IC Packaging Market?
Major companies operating in the 3D IC and 2.5D IC packaging market include:
• Samsung Electronics Co. Ltd.
• Siemens AG
• Intel Corporation
• Taiwan Semiconductor Manufacturing Company Limited
• SK Hynix Inc.
• Broadcom Inc.
• Fujitsu Limited
• Toshiba Corporation
• ASE Technology Holding Co. Ltd.
• Texas Instruments Incorporated
• STMicroelectronics NV
• Infineon Technologies AG
• Renesas Electronics Corporation
• United Microelectronics Corporation
• GlobalFoundries Inc.
• Amkor Technology Inc.
• Unimicron Technology Corporation
• Jiangsu Changjiang Electronics Technology Co. Ltd.
• Cadence Design Systems Inc.
• Siliconware Precision Industries Co. Ltd.
• Powertech Technology Inc.
• Ansys Inc.
• STATS ChipPAC Pte. Ltd.
• Synopsys Inc
• UTAC Holdings Ltd.
• Tessolve Semiconductor Private Limited
• Invensas Corporation
• National Center for Advanced Packaging Co. Ltd.
• Tohoku-MicroTec Co. Ltd
• TechSearch International Inc.
What are the Regional Insights into the 3D IC And 2.5D IC Packaging Market?
Asia-Pacific was the largest region in the 3D IC And 2.5D IC market in 2024. It is expected to be the fastest-growing region in the forecast period. The regions covered in the 3D IC And 2.5D IC packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
