What Has Been the Growth of the Advanced Chip Packaging Market So Far?
The advanced chip packaging market has seen considerable growth due to a variety of factors.
• The advanced chip packaging market will grow from $12.41 billion in 2024 to $14.71 billion in 2025 at a CAGR of 18.5%.
Growth drivers include the demand for smaller, more powerful consumer electronics, the rise of mobile devices, high-speed data networks, expanding automotive electronics, and evolving computing needs.
What Are the Future Growth Projections for the Advanced Chip Packaging Market Size?
The advanced chip packaging market is expected to maintain its strong growth trajectory in upcoming years.
• The advanced chip packaging market is expected to reach $28.69 billion by 2029, growing at a CAGR of 18.2%.
The growth is driven by 5G proliferation, the rise of IoT devices, AI and machine learning, and wearable technology. Key trends include the adoption of 3D packaging, advanced thermal management, high-density interconnects, fan-out wafer-level packaging, and flexible packaging technologies.
What Are The Key Drivers Fueling Growth In The Advanced Chip Packaging Market?
The growing demand for consumer electronic devices is expected to boost the growth of the advanced chip packaging market. Consumer electronics, such as smartphones, tablets, and laptops, are increasingly popular due to the expansion of wireless networks and the internet. Advanced chip packaging technologies allow the integration of multiple functions into compact designs, essential for the high-performance consumer electronics market. For instance, in May 2023, the Japan Electronics and Information Technology Industries Association reported that consumer electronics production had reached $209.50 million, a 127% increase from the previous year. This growing demand for consumer devices will drive the advanced chip packaging market.
What Are The Major Segments Within The Global Advanced Chip Packaging Market?
The advanced chip packaging market covered in this report is segmented –
1) By Packaging: Ball Grid Array (BGA), Quad Flat Package (QFP), Chip Scale Package (CSP), Wafer-Level Chip Scale Package (WLCSP)
2) By Technology: Five-Dimensional (5D) Packaging, Three-Dimensional (3D) Packaging, Fan-Out Wafer-Level Packaging, Flip-Chip Packaging, System-In-Package Solutions
3) By End-Use Industry: Electronics, Automotive, Telecommunications, Industrial, Healthcare, Aerospace And Defense
Subsegments:
1) By Ball Grid Array (BGA): Micro BGA, Tape BGA, Plastic BGA (PBGA), Ceramic BGA (CBGA)
2) By Quad Flat Package (QFP): Thin QFP (TQFP), Plastic QFP (PQFP), Low-Profile QFP (LQFP), Heat Sink QFP (HQFP)
3) By Chip Scale Package (CSP): Flip-Chip CSP, Wafer-Level CSP, Fan-In CSP, Fan-Out CSP
4) By Wafer-Level Chip Scale Package (WLCSP): Flip-Chip WLCSP, Redistribution Layer (RDL) WLCSP, Fan-Out WLCSP, Bumped WLCSP
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Which Trends Are Expected To Transform The Advanced Chip Packaging Market?
Companies in the advanced chip packaging market are working on chip-scale package (CSP) technology to improve semiconductor device performance and reliability. For example, in September 2022, Bridgelux Inc., a U.S.-based LED innovation company, introduced CSP LEDs ranging from 1800K to 6500K, offering better heat management and higher luminous flux production. These CSP LEDs are designed to provide flexible board assembly, helping create custom Chip-on-Board (COB) modules for various lighting applications.
Who Are the Key Players In The Advanced Chip Packaging Market?
Major companies operating in the advanced chip packaging market are:
• Samsung Electronics Co. Ltd.
• Advanced Micro Devices Inc.
• Advanced Semiconductor Engineering Inc
• Henkel Group
• Texas Instruments Incorporated
• Lam Research Corporation
• NXP Semiconductors
• Onsemi
• Amkor Technology
• Nordson Corporation
• Siliconware Precision Industries Co. Ltd.
• Kulicke and Soffa Industries Inc.
• ChipMOS Technologies Inc.
• SUSS MicroTec SE
• EV Group
• Indium Corporation
• Palomar Technologies
• Brewer Science Inc.
• MacDermid Alpha Electronics Solutions
• Universal Instruments Corporation
• CHIPBOND Technology Corporation
What Is The Most Dominant Region In The Advanced Chip Packaging Market?
Asia-Pacific was the largest region in the advanced chip packaging market in 2023. The regions covered in the advanced chip packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
