Global Envelope Tracking Chip Market Size 2024, Forecast To 2033

6 Mar, 2024

The envelope tracking chip market has experienced rapid growth, increasing from $2.06 billion in 2023 to $2.29 billion in 2024, with a compound annual growth rate (CAGR) of 11.0% during the historical period. This growth is attributed to factors such as the proliferation of mobile devices, the evolution of networks, consumer demand for longer battery life, trends in miniaturization, and the challenges posed by rising power consumption. Moving into the future, the market is expected to maintain strong growth, reaching $3.34 billion in 2028 with a CAGR of 9.8%. Anticipated growth drivers for the forecast period include continued mobile device proliferation, network evolution, sustained consumer demand for longer battery life, ongoing miniaturization trends, and the persistent challenges of rising power consumption. Key trends during this period encompass the emergence of gallium nitride (GaN) technology, the development of compact and lightweight designs, a focus on energy-efficient networks, research and development for advanced semiconductor materials, and an emphasis on market competitiveness and innovation.

Global Envelope Tracking Chip Market Key Driver

Significant growth in the electronics industry is expected to propel the growth of the envelope tracking chip market going forward. The electronics industry refers to a field that includes the design, development, production, and sale of electronic components, devices, and systems. These include consumer electronics, telecommunications equipment, computers, semiconductors, and industrial electronics. Envelope tracking chips are used in electronic devices such as mobile devices, wearables, and IoT devices to extend battery life and improve overall performance by enabling power amplifiers in mobile devices to operate at maximum efficiency, thereby reducing wasted energy and improving battery life. For instance, in March 2023, according to the United Nations COMTRADE database, a US-based intergovernmental organization, Australia's electrical and electronic equipment exports totaled $3.56 billion in 2022. Additionally, in February 2022, India's export of electronic goods rose by almost 88% from $6600 million in 2013-14 to $12,400 million in 2021-22. Therefore, growth in the electronics industry is driving the growth of the envelope tracking chip market. The envelope tracking chip market is anticipated to expand significantly in 2024, aligning with the growth trajectory of the electronics industry and its increasing demand for power-efficient components.

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Global Envelope Tracking Chip Market Segments

The envelope tracking chip market covered in this report is segmented –
1) By Technology: Cellular Communications, Wireless Communications, Satellite Communications
2) By Application: Smart Phones, Wearable Devices, Other Application
3) By Industry: Telecommunications, Healthcare, Consumer Electronics, Defense, Automotive, Other Industry
By Geography:The regions covered in the envelope tracking chip market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain North America was the largest region in the envelope tracking chip market in 2023. Asia-Pacific is expected to be the fastest-growing region in the global envelope tracking chip market report during the forecast period. The regions covered in the envelope tracking chip market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa

Major Envelope Tracking Chip Industry Players

Analog Devices Inc., Broadcom Inc., Efficient Power Conversion Corporation, Keysight Technologies Inc., MediaTek Inc., Qorvo Inc., Qualcomm Incorporated., R2 Semiconductor Inc., Skyworks Solutions Inc., Texas Instruments Incorporated., Maxim Integrated Products Inc., Linear Technology Corporation, Artesyn Embedded Technologies Inc., TriQuint Semiconductor Inc., Nujira Ltd., Samsung Electronics Co. Ltd., NXP Semiconductors N.V., Infineon Technologies AG, STMicroelectronics N.V., MACOM Technology Solutions Holdings Inc., Murata Manufacturing Co. Ltd., TDK Corporation, Taiyo Yuden Co. Ltd., Integrated Device Technology Inc., Microchip Technology Inc., Renesas Electronics Corporation, Toshiba Corporation, Fujitsu Limited, ROHM Semiconductor, ON Semiconductor Corporation

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Envelope Tracking Chip Market Overview

An envelope tracking chip is a type of power management integrated circuits (PMIC) used in mobile devices to improve energy efficiency and extend battery life. This technique involves tracking the RF signal's amplitude envelope and adjusting the bias voltage for maximum power amplifier efficiency.

Envelope Tracking Chip Global Market Report 2023 provides data on the global envelope tracking chip market such as market size, growth forecasts, segments and geographies, competitive landscape including leading competitors’ revenues, profiles and market shares. The envelope tracking chip market report identifies opportunities and strategies based on market trends and leading competitors’ approaches.