Global Flip Chip market research 2024, Forecast To 2033
31 Jan, 2024
The flip chip market has experienced rapid growth, rising from $34.9 billion in 2023 to $38.88 billion in 2024, indicating a compound annual growth rate (CAGR) of 11.4%. The growth in the historic period is attributed to miniaturization and size reduction, improved electrical performance, growth in the consumer electronics sector, enhanced heat dissipation, and increased speed and data transmission. Anticipating rapid growth in the next few years, the market is expected to reach $60.48 billion in 2028, with a CAGR of 11.7%. The forecasted growth is linked to automotive electronics, high-density interconnects, heterogeneous integration, 3D IC integration, and advancements in semiconductor materials. Major trends in the forecast period include 5G and high-performance computing, the expansion of the Internet of Things (IoT), advanced packaging technologies, acceleration in AI and machine learning, and developments in quantum computing.
Global Flip Chip Market Key Driver
The rise in sales of electronic products is set to propel the growth of the flip chips market. Flip chips, improving portable electrical devices, witness increased sales globally. According to Gartner, the installed base of devices is expected to reach 6.4 billion units in 2022. The surge in electronic product sales drives growth in the flip chips market.
Get A Free Sample Of The Global Flip Chip Market ReportGlobal Flip Chip Market Segments
The global flip chip market covered in this report is segmented –
1) By Packaging Technology: 3D IC, 2.5D IC, 2D IC
2) By Bumping Technology: Copper Pillar, Solder Bumping, Tin-Lead Eutectic Solder, Lead-Free Solder
3) By Industry: Electronics, Heavy Machinery and Equipment, IT and Telecommunication, Automotive, Other Industries
By Geography: The regions covered in the Flip Chip market report are Asia-Pacific, Western Europe, Eastern Europe,North America, South America, Middle East, and Africa.
Asia-Pacificwas the largest region in the flip chip market in 2023 and is expected to be the fastest-growing region in the forecast period. The regions covered in the flip chip market report include Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.
Major Flip Chip Industry Players
3M Company, Advanced Micro Devices Inc., Amkor Technology Inc., Apple Inc., Fujitsu Limited., Intel Corporation, International Business Machines Corporation, Samsung Electronics Co. Ltd., Texas Instruments Incorporated, ASE Technology Holding Co. Ltd., Chipbond Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd, Siliconware Precision Industries Co. Ltd., Unimicron Technology Corporation, Ibiden Co. Ltd., Nan Ya Printed Circuit Board Corporation, Shiko Electric Industries Co. Ltd., Austria Technologie & Systemtechnik AG, Kinsus Interconnect Technology Corporation, STATS ChipPAC Pte. Ltd., Powertech Technology Inc., UTAC Holdings Ltd, Taiwan Semiconductor Manufacturing Co., TF-AMD Microelectronics Sdn Bhd., Zhen Ding Technology Holding Ltd., Engent Inc., Masterwork Electronics, Advotech Company Inc., First Level Inc., Flipchip International LLC, Cormetech Inc., DCL International Inc.
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Flip Chip Market Overview
Flip chips are also known as direct chip attach where interconnecting dies such as semiconductor devices, IC chips, integrated passive devices, and microelectromechanical systems (MEMS) are attached bond pad side down to a substrate or carrier. These have numerous benefits, such as lower cost, high packaging density, improved circuit reliability, and small dimensions. It is used in the flip-chip packaging process to link the chip and the substrate of a package carrier. Any surface of a flip chip can be interconnected, typically with copper, nickel, or soldered metal bumps. These bumps are installed on the die surface and aid in the electrical connection between the device and the box substrate.
Flip Chip Global Market Report 2023 provides data on the global flip chip market such as market size, growth forecasts, segments and geographies, competitive landscape including leading competitors’ revenues, profiles and market shares. The flip chip market report identifies opportunities and strategies based on market trends and leading competitors’ approaches.