The advanced chip packaging market is growing rapidly, rising from $10.51 billion in 2023 to $12.41 billion in 2024, at a CAGR of 18.1%. This growth is fueled by the demand for smaller, more powerful devices and the rise of mobile technologies. By 2028, the market is expected to reach $24.29 billion, reflecting a CAGR of 18.3%. Key factors driving future growth include the proliferation of 5G and IoT devices, along with advancements in packaging technologies. Trends shaping the market include the adoption of flexible and stretchable packaging solutions.
Major Driver In The Advanced Chip Packaging Market
The advanced chip packaging market is expected to expand, fueled by the growing demand for consumer electronic devices. With the proliferation of smartphones, tablets, and laptops, the need for advanced chip packaging technologies is critical. These innovations allow for compact, high-performance designs that enhance processing power and efficiency. The Japan Electronics and Information Technology Industries Association reported that consumer electronics production reached $209.50 million in May 2023, a 127% increase from the previous year, highlighting the market’s potential.
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Advanced Chip Packaging Market Competitive Landscape
Samsung Electronics Co. Ltd., Advanced Micro Devices Inc., Advanced Semiconductor Engineering Inc, Henkel Group, Texas Instruments Incorporated, Lam Research Corporation, NXP Semiconductors, Onsemi, Amkor Technology, Nordson Corporation, Siliconware Precision Industries Co. Ltd., Kulicke and Soffa Industries Inc., ChipMOS Technologies Inc., SUSS MicroTec SE, EV Group, Indium Corporation, Palomar Technologies, Brewer Science Inc., MacDermid Alpha Electronics Solutions, Universal Instruments Corporation, CHIPBOND Technology Corporation
Key Advanced Chip Packaging Market Trend
In the advanced chip packaging market, companies are focusing on chip-scale package (CSP) technology to enhance semiconductor performance and reliability. Bridgelux Inc. launched CSP LEDs in September 2022, utilizing flip-chip technology that improves heat management and increases luminous flux. These LEDs, with their compact design, allow for flexible board assembly, making them ideal for various lighting applications.
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Advanced Chip Packaging Market Segmentation
The advanced chip packaging market covered in this report is segmented –
1) By Packaging: Ball Grid Array (BGA), Quad Flat Package (QFP), Chip Scale Package (CSP), Wafer-Level Chip Scale Package (WLCSP)
2) By Technology: Five-Dimensional (5D) Packaging, Three-Dimensional (3D) Packaging, Fan-Out Wafer-Level Packaging, Flip-Chip Packaging, System-In-Package Solutions
3) By End-Use Industry: Electronics, Automotive, Telecommunications, Industrial, Healthcare, Aerospace And Defense
By Geography:The regions covered in the advanced chip packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
Asia-Pacific was the largest region in the advanced chip packaging market in 2023.
The Advanced Chip Packaging Global Market Report 2024 furnishes information about the global advanced chip packaging market, encompassing details like market size, projections for growth, segmentation across various sectors and regions, and an overview of competitors, including their revenues, profiles, and market shares. Furthermore, the report pinpoints potential opportunities and strategic directions derived from market trends and the strategies adopted by key competitors. The report also offers an assessment of how the COVID-19 pandemic, the Russia-Ukraine conflict, and increasing inflation have affected both global and regional markets, furnishing valuable strategic insights for businesses.
