Global High Density Interconnect Market Report 2023: Forecast Market Size, Growth Rate And Key Drivers

26 Oct, 2023

The global high-density interconnect market is projected to rise from $12.9 billion in 2022 to $15.05 billion in 2023, boasting a compound annual growth rate (CAGR) of 16.6%. By 2027, this market is anticipated to further expand, reaching a valuation of $22.36 billion with a CAGR of 10.4%.

Global High Density Interconnect Market Key Driver

The high-density interconnect market is set to experience significant growth, primarily driven by the expanding utilization within the automotive industry. This sector comprises a multitude of enterprises engaged in various aspects, including the creation, enhancement, production, promotion, sales, and maintenance of motor vehicles. High-density interconnect (HDI) technology offers a multitude of advantages to the automotive industry, such as enhancements in performance, heightened reliability, improved signal transmission, reduced component sizes, and cost efficiencies.

Get a Sample of the global high density interconnect market report

Global High Density Interconnect Market Segments

The global high density interconnect market is segmented:
1) By Type: Single Panel, Double Panel, Other Types
2) By Substrate: Rigid, Flexible, Rigid-Flex
3) By End User: Automotive, Consumer Electronics, Telecommunications, Medical, Other End-Users
4) By Geography: The regions covered in the high density interconnect market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, and Africa. Among these regions, Asia-Pacific accounts for the largest share in the global high density interconnect market.

Major High Density Interconnect Industry Players

  • Unimicron Technology Corporation
  • TTM Technologies Inc.
  • Austria Technologies & Systemtechnik AG
  • Zhen Ding Tech. Group
  • Meiko Electronics Co. Ltd.
  • Fujitsu Limited
  • Multek Corporation
  • NCAB Group
  • Sierra Circuits Inc.
  • Get the full global high density interconnect industry report here

    High Density Interconnect Market Overview

    High-density interconnect (HDI) refers to a type of printed circuit board (PCB) designed to accommodate a greater number of components within the same board space. Its purpose is to minimize the PCB's size while simultaneously enhancing its capabilities and incorporating additional features on a single board.

    High Density Interconnect Global Market Report 2023 provides data on the global high density interconnect market such as market size, growth forecasts, segments and geographies, competitive landscape including leading competitors’ revenues, profiles and market shares. The high density interconnect market report identifies opportunities and strategies based on market trends and leading competitors’ approaches.