The integrated circuit (ic) sockets market has seen considerable growth due to a variety of factors.
• The integrated circuit (IC) sockets market has expanded significantly in recent years. It will rise from $1.83 billion in 2024 to $1.99 billion in 2025, reflecting a CAGR of 8.8%.
The increase is driven by the growing adoption of consumer electronics, the semiconductor industry's growth, expansion in telecommunications, the rise of IoT devices, the increasing use of memory devices, and government-led digitalization initiatives.
The integrated circuit (ic) sockets market is expected to maintain its strong growth trajectory in upcoming years.
• The integrated circuit (IC) sockets market is set to grow to $2.75 billion by 2029 at a CAGR of 8.5%.
This growth is driven by the expansion of 5G technology, higher demand in the automotive sector, the rise of IoT devices, quantum computing, more investment in data centers, and growth in the healthcare sector. Major trends include advanced packaging technologies, high-speed low-latency IC sockets, eco-friendly materials, customization, AI-driven design, and collaborations.
The increasing demand for consumer electronics is expected to fuel the growth of the integrated circuit (IC) sockets market. Consumer electronics, such as smartphones, tablets, and smart home devices, are becoming more advanced and accessible to a broader audience. IC sockets are essential for connecting and disconnecting integrated circuits, ensuring device performance and longevity. The Shanghai Municipal People's Government projected a 4% growth in consumer electronics retail sales in China, reaching 2.2 trillion yuan ($305 billion) in 2023. The rising demand for consumer electronics is driving the IC sockets market.
The integrated circuit (IC) sockets market covered in this report is segmented –
1) By Type: Dual In-Line Memory Module Sockets (DIMM), Production Sockets, Test Or Burn-In Sockets, Through-Hole Sockets, Surface-Mount Sockets, Zero Insertion Force (ZIF) Sockets, Dual-Row Sockets, Other Types
2) By Application: Memory, Complementary Metal-Oxide-Semiconductor (CMOS) Image Sensors, High Voltage, Radio Frequency (RF), System On Chip (SOC), Central Processing Unit (CPU), Graphics Processing Unit (GPU), Other Non-Memory
3) By Industry Vertical: Home Appliances, Cars And Transportation, Aerospace And Defense, Telecom, Industrial
Subsegments:
1) By Dual In-Line Memory Module Sockets (DIMM): Standard Dimm Sockets, Registered Dimm (RDIMM) Sockets, Unbuffered Dimm (UDIMM) Sockets, Load-Reduced Dimm (LRDIMM) Sockets
2) By Production Sockets: Sockets For Surface-Mounted Ics, Sockets For Through-Hole Ics, Custom Production Sockets
3) By Test Or Burn-In Sockets: Test Sockets For Prototype Ics, Burn-In Sockets For Reliability Testing, Low-Force Test Sockets, High-Performance Test Sockets
4) By Through-hole Sockets: Single-Row Through-Hole Sockets, Dual-Row Through-Hole Sockets, High-Density Through-Hole Sockets
5) By Surface-Mount Sockets: Standard Surface-Mount Sockets, Low-Profile Surface-Mount Sockets, High-Density Surface-Mount Sockets
6) By Zero Insertion Force (ZIf) Sockets: Standard Zif Sockets, Low-Profile Zif Sockets, High-Speed Zif Sockets
7) By Dual-Row Sockets: Dual-Row Ic Sockets For High-Density Applications, Dual-Row Sockets For Through-Hole Components, Dual-Row Sockets For Surface-Mounted Components
8) By Other Types: Flip-Chip Sockets, Bga (Ball Grid Array) Sockets, Pga (Pin Grid Array) Sockets, Chip-On-Board (Cob) Sockets
In an effort to meet the rising demand for enhanced performance and reduced power usage, major players in the integrated circuit (IC) sockets industry are shifting their focus towards DDR Memory IC test sockets. These specific connectors are used to assess DDR memory chips, ensuring secure electrical connections for performance and functionality testing. To illustrate, LNP Konduit, an innovative compound formulated explicitly for complex DDR memory IC test sockets, was launched by Saudi Basic Industries Corporation, a manufacturing company based in Saudi Arabia, in November 2022. This advanced material boasts an extremely high thermal conductivity range of 1–18 W/mK, promoting efficient heat transfer and superior thermal stability during testing. It also has great dimensional stability and a high heat deflection temperature, making it particularly suitable for the intense conditions of DDR memory IC testing.
Major companies operating in the integrated circuit (IC) sockets market are:
• Panasonic Corporation
• 3M Company
• Texas Instruments Incorporated
• Kyocera Corporation
• TE Connectivity Ltd.
• Amphenol Corporation
• Omron Corporation
• Sensata Technologies B.V.
• Molex Inc.
• Würth Elektronik eiSos GmbH & Co. KG
• WAGO Kontakttechnik GmbH & Co. KG
• Hirose Electric Co. Ltd.
• Samtec Inc.
• Smith’s Interconnect Inc.
• Winchester Electronics Corporation
• ept GmbH
• Enplas Corporation
• Yamaichi Electronics Co. Ltd.
• Mill-Max Mfg. Corporation
• Johnstech International Corporation
• Johanson Technology Inc.
• Harwin PLC
• NorComp Inc.
• Chupond Precision Co. Ltd.
• CnC Tech LLC
• Aries Electronics
Asia-Pacific was the largest region in the integrated circuit (IC) sockets market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the integrated circuit (IC) sockets market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.