Global Wafer Processing Equipment Market Trends And Strategies Of Major Players In The Wafer Processing Equipment Market 2021-2030

14 Oct, 2021

The wafer processing equipment market consists of sales of wafer processing equipment by entities (organizations, sole traders, or partnerships) that are engaged in manufacturing wafer processing equipment used for processing wafer, which is a thin slice of semiconductor, such as crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. Only goods and services traded between entities or sold to end consumers are included.

Global Wafer Processing Equipment Market Size And Drivers:

The global wafer processing equipment market is expected to grow from $175.21 billion in 2020 to $189.78 billion in 2021 at a compound annual growth rate (CAGR) of 8.3%. The growth is mainly due to the companies rearranging their operations and recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The market is expected to reach $257.5 billion in 2025 at a CAGR of 7.9%. Increasing demand for consumer electronic devices is expected to boost the growth of the wafer processing equipment market.

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Trends In The Global Wafer Processing Equipment Market

Growing demand for miniaturized wafers with the improved performance of devices is a leading trend in the wafer processing equipment market. Semiconductor substrates such as wafers are thinned down to final thicknesses of tens of µm. Most of the semiconductor wafers such as those used in memory, CIS, and power applications are thinned down to 100 µm-200 µm. Further thickness reduction with the necessity to maximize memory capacity of single packages, improved data transfer rates, power consumption mostly fueled by mobile applications is required in the case of memory devices. Standard memory devices such as 2D NAND/DRAM use silicon wafers that are thicker than 200 µm. By 2025, 3D stacked DRAM thickness is expected to keep reducing from 50 µm - 30 µm thick silicon substrates. Currently, BSI CIS wafers are the thinnest wafers across all applications with a thickness below 10 µm. Thus, ultra-smooth surfaces and thinner wafers for incorporation into the devices are continuously gaining popularity in recent years.

Global Wafer Processing Equipment Market Segments:
The global wafer processing equipment market is further segmented –
By Equipment Type: Oxidation Systems, Diffusion Systems, Epitaxial Reactors, Photolithography Equipment, Others
By End Use: Medical, Military, Solar, Industrial, Others
By Application: MEMS, RFID, CMOS Image Sensor, Others
By Geography: The global wafer processing equipment market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa.

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Wafer Processing Equipment Global Market Report 2021 is one of a series of new reports from The Business Research Company that provides wafer processing equipment market overviews, analyzes and forecasts market size and growth for the global wafer processing equipment market, wafer processing equipment market share, wafer processing equipment market players, wafer processing equipment market segments and geographies, wafer processing equipment market’s leading competitors’ revenues, profiles and market shares. The wafer processing equipment market report identifies top countries and segments for opportunities and strategies based on market trends and leading competitors’ approaches.