Advanced Packaging Technologies Global Market To Reach Value Of About $8.1 Billion In 2025
13 Aug, 2021
The advanced packaging technologies market consists of sales of advanced packaging technologies by entities (organizations, sole traders and partnerships) that provide various packaging techniques based on parameters such as power consumption, operating conditions, measurable size, and cost. Advanced packaging technologies are a collection of techniques that include 2.5D 3D-IC, wafer-level packaging, and more. It allows integrated circuits to be enclosed in a casing, which protects metallic parts from corrosion and physical damage.
Global Advanced Packaging Technologies Market Size And Drivers:
The global advanced packaging technologies market is expected to grow from $4.31 billion in 2020 to $4.94 billion in 2021 at a compound annual growth rate (CAGR) of 14.7%. The growth in the advanced packaging technologies market is mainly due to the companies resuming their operations and adapting to the new normal while recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The market is expected to reach $8.11 billion in 2025 at a CAGR of 13.2%. The growing demand for consumer electronics is expected to drive the growth of the advanced packaging market in the coming years.
Request For A Sample For The Global Advanced Packaging Technologies Market Report:
Trends In The Global Advanced Packaging Technologies Market
Growing technological advancements are shaping the advanced packaging technologies market. Major companies operating in the advanced packaging technologies sector are focused on developing technological solutions for advanced packaging to expand their leadership in semiconductor solutions. For instance, in May 2021 Samsung Electronics, a South Korea-based electronics company launched Interposer-Cube4 (I-Cube4), an advanced chip packaging technology for high-performance applications. Interposer-Cube4 (I-Cube4), a 2.5D packaging technology improves communication and power effectiveness among logic and memory chips and is projected to be widely used in sectors such as high-performance computing, artificial intelligence (AI), 5G, cloud, and the largest data center applicants.
Global Advanced Packaging Technologies Market Segments:
The global advanced packaging technologies market is further segmented based on type, product, end use industry and geography.
By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Others
By Product: Active Packaging, Smart And Intelligent Packaging
By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Others
By Geography: The global advanced packaging technologies market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa. Among these regions, Asia Pacific was the largest region in global advanced packaging technologies market in 2020.
Read More On The Report For The Global Advanced Packaging Technologies Market At:https://www.thebusinessresearchcompany.com/report/advanced-packaging-technologies-global-market-report
Advanced Packaging Technologies Global Market Report 2021 is one of a series of new reports from The Business Research Company that provides advanced packaging technologies market overviews, analyzes and forecasts market size and growth for the global advanced packaging technologies market, advanced packaging technologies market share, advanced packaging technologies market players, advanced packaging technologies market segments and geographies, advanced packaging technologies market’s leading competitors’ revenues, profiles and market shares. The advanced packaging technologies market report identifies top countries and segments for opportunities and strategies based on market trends and leading competitors’ approaches.