Global Semiconductor Assembly And Packaging Equipment Market Trends And Strategies Of Major Players In The Semiconductor Assembly And Packaging Equipment Market 2021-2030

The semiconductor assembly and packaging equipment market consists of sales of semiconductor assembly and packaging equipment by entities (organizations, sole traders, or partnerships) that are engaged in manufacturing equipment used for semiconductor assembly and packaging. Only goods and services traded between entities or sold to end consumers are included.

Global Semiconductor Assembly And Packaging Equipment Market Size And Drivers:

The global semiconductor assembly and packaging equipment market is expected to grow from $11.92 billion in 2020 to $13.44 billion in 2021 at a compound annual growth rate (CAGR) of 12.8%. The growth is mainly due to the companies rearranging their operations and recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The market is expected to reach $21.39 billion in 2025 at a CAGR of 12.3%. Rising demand for consumer electronics is anticipated to contribute to the growth of the semiconductor assembly and packaging equipment market.

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Trends In The Global Semiconductor Assembly And Packaging Equipment Market

In July 2019, Applied Materials, Inc., a US-based company engaged in providing semiconductor chips manufacturing equipment, services, and software for electronic devices acquired Kokusai Electric Corporation for $2.2 billion. This acquisition would help the company to enhance its products & services for foundry, logic, and memory customers along with further enhancing its single wafer processing system. Kokusai Electric Corporation is a Japan-based manufacturer of semiconductor manufacturing systems.

Global Semiconductor Assembly And Packaging Equipment Market Segments:
The global semiconductor assembly and packaging equipment market is further segmented –
By Type: Plating Equipment, Inspection and Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment
By Application: Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Others
By End-User: OSATs, IDMs
By Geography: The global semiconductor assembly and packaging equipment market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa.

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Semiconductor Assembly And Packaging Equipment Global Market Report 2021 is one of a series of new reports from The Business Research Company that provides semiconductor assembly and packaging equipment market overviews, analyzes and forecasts market size and growth for the global semiconductor assembly and packaging equipment market, semiconductor assembly and packaging equipment market share, semiconductor assembly and packaging equipment market players, semiconductor assembly and packaging equipment market segments and geographies, semiconductor assembly and packaging equipment market’s leading competitors’ revenues, profiles and market shares. The semiconductor assembly and packaging equipment market report identifies top countries and segments for opportunities and strategies based on market trends and leading competitors’ approaches.