3D IC Design and Manufacturers Software Market Report 2026

3D IC Design and Manufacturers Software Market Overview

• 3D IC Design and Manufacturers Software market size has reached to $12.99 billion in 2025 • Expected to grow to $22.73 billion in 2030 at a compound annual growth rate (CAGR) of 11.7% • Growth Driver: The Expansion of Advanced Semiconductor Packaging Technologies Is Fueling the Growth of the Market Due to Increasing Demand for 2.5D and 3D Integrated Chip Designs • Market Trend: Technological Advancements In Artificial Intelligence (AI)-Powered Three-Dimensional Integrated Circuit (3D IC) Design Tools Enhance Semiconductor Design Automation • Asia-Pacific was the largest region in 2025 and North America is the fastest growing region.

What Is Covered Under 3D IC Design and Manufacturers Software Market?

3D IC design and manufacturers software refers to specialized software platforms used to design, simulate, verify, and optimize three-dimensional integrated circuits and advanced semiconductor packages. These software solutions enable engineers to perform chip floorplanning, thermal analysis, signal and power integrity analysis, physical verification, manufacturing process simulation, and design optimization for high-performance semiconductor devices used in artificial intelligence, high-performance computing, consumer electronics, automotive electronics, and data centers. The main components of 3D IC design and manufacturers software include through silicon via design tools, and through glass via design tools. Through silicon via design tools refer to software solutions used to design and optimize vertical electrical connections that pass through silicon substrates in three dimensional integrated circuits. These solutions support three dimensional stacked integrated circuits, monolithic three dimensional integrated circuits, wafer level packaging, and heterogeneous integration. They are deployed through Cloud-Based and On-Premises models and are used by end users including consumer electronics, telecommunications and information and communication technology, automotive electronics, healthcare and medical devices, aerospace and defense, industrial electronics, and others.

What Is The 3D IC Design and Manufacturers Software Market Growth Forecast?

The 3D IC design and manufacturers software market size is expected to see rapid growth in the next few years. It will grow to $22.73 billion in 2030 at a compound annual growth rate (CAGR) of 11.7%. The growth in the forecast period can be attributed to rising demand for 3D integrated circuit optimization, increasing adoption of heterogeneous semiconductor integration, growing demand for advanced thermal management analysis, expanding use of three dimensional chip architectures, rising need for automated semiconductor design verification. Major trends in the forecast period include increasing adoption of advanced 3D IC design automation, rising demand for thermal analysis and optimization, growing need for signal and power integrity verification, increasing use of physical verification and design optimization tools, rising demand for manufacturing process simulation.

What Is The Driver Of The 3D IC Design and Manufacturers Software Market?

The increasing expansion of advanced semiconductor packaging technologies is expected to propel the growth of the 3D IC design and manufacturers software market going forward. Advanced semiconductor packaging technologies refer to semiconductor integration methods that combine multiple dies, chiplets, and heterogeneous components through advanced interconnection techniques such as 2.5D integration, 3D stacking, and wafer-level packaging to improve performance, power efficiency, and integration density. Advanced semiconductor packaging technologies are increasing due to the rising demand for artificial intelligence (AI) and high-performance computing (HPC) applications that require advanced packaging solutions such as 2.5D and 3D integration. The increasing expansion of advanced semiconductor packaging technologies supports 3D IC design and manufacturing software by increasing the complexity of multi-die integration, requiring advanced tools for chiplet co-design, interconnect optimization, thermal analysis, and manufacturing verification. For instance, in July 2024, according to the National Institute of Standards and Technology (NIST), a US-based government agency, the Biden-Harris Administration announced a $1.6 billion investment to establish and accelerate domestic semiconductor advanced packaging capabilities through the CHIPS for America program. Therefore, the increasing expansion of advanced semiconductor packaging technologies is driving the growth of the 3D IC design and manufacturers software industry.

Key Players In The Global 3D IC Design and Manufacturers Software Market

Major companies operating in the 3D IC design and manufacturers software market are Arteris Inc., Baya Systems Inc., Cadence Design Systems Inc., COMSOL AB, Crosslight Software Inc., Dassault Systèmes SE, Empyrean Technology Co. Ltd., Keysight Technologies Inc., MathWorks Inc., Microwind, Monozukuri S.p.A., PDF Solutions Inc., Primarius Technologies Co. Ltd., Rescale Inc., Siemens AG, Silvaco Group Inc., Synopsys Inc., XEPIC Corporation Limited, Xpeedic Technology Co. Ltd., Zuken Inc.

Global 3D IC Design and Manufacturers Software Market Trends and Insights

Major companies operating in the 3D IC design and manufacturers software market are focusing on developing advanced solutions, such as artificial intelligence (AI)-powered three-dimensional integrated circuit (3D IC) design tools, to improve engineering productivity, accelerate design workflows, and enhance semiconductor design quality. Artificial intelligence (AI)-powered three-dimensional integrated circuit (3D IC) design tools refer to software solutions that use AI to automate the design, simulation, verification, and optimization of vertically stacked integrated circuits, enabling faster development and more efficient manufacturing workflows. For instance, in March 2026, Siemens AG, a Germany-based technology company, launched the Fuse EDA AI Agent, a purpose-built autonomous artificial intelligence (AI) system for semiconductor, 3D IC, and printed circuit board (PCB) design workflows. Designed to improve engineering productivity and design quality, the solution autonomously orchestrates multi-agent workflows across Siemens' electronic design automation (EDA) portfolio, spanning design conception, verification, and manufacturing sign-off. Built on the Fuse EDA AI system, it features retrieval-augmented generation (RAG), multimodal EDA data support, secure agent orchestration with Model Context Protocol (MCP) and Agent Skills, open third-party integration, and support for NVIDIA Agent Toolkit, Nemotron models, and NVIDIA AI infrastructure to enhance reasoning, tool calling, and workflow automation.

What Are Latest Mergers And Acquisitions In The 3D IC Design and Manufacturers Software Market?

In February 2026, Siemens AG, a Germany-based technology company, acquired Canopus AI for an undisclosed amount. Through this acquisition, Siemens aims to strengthen its electronic design automation (EDA) software portfolio by integrating Canopus AI’s AI-powered computational metrology and inspection technologies into its Calibre platform, enhancing semiconductor design-to-manufacturing workflows, improving wafer pattern fidelity, accelerating yield ramp, and reducing time-to-volume for advanced semiconductor nodes. Canopus AI is a France-based software company that develops AI-driven computational metrology and inspection solutions for wafer and mask manufacturing in the semiconductor industry.

What Defines the 3D IC Design and Manufacturers Software Market?

The 3D IC design and manufacturers software market includes revenues earned by entities by providing services such as development and licensing of electronic design automation software, chip packaging design, physical verification, and design optimization. The market value includes the value of related goods sold by the service provider or included within the service offering. Only goods and services traded between entities or sold to end consumers are included.

How is Market Value Defined and Measured?

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified). The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

What Key Data and Analysis Are Included in the 3D IC Design and Manufacturers Software Market Report 2026?

The 3d ic design and manufacturers software market research report is one of a series of new reports from The Business Research Company that provides market statistics, including industry global market size, regional shares, competitors with the market share, detailed market segments, market trends and opportunities, and any further data you may need to thrive in the 3d ic design and manufacturers software industry. The market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future state of the industry.