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Ball Grid Array (BGA) Packaging Global Market Report 2025
Global Ball Grid Array (BGA) Packaging Market Report 2025
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Published : December 2025

Pages : 175

Format : PDF

Delivery Time : 2-3 Business Days

Report Price : $4490.00

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Ball Grid Array (BGA) Packaging Global Market Report 2025

By Type (Molded Array Process Ball Grid Array (BGA), Thermally Enhanced Ball Grid Array (BGA), Package On Package (PoP) Ball Grid Array (BGA), Micro Ball Grid Array (BGA)), By Material ( Ceramic, Plastic, Tape), By Application (Wafer Scale Packaging, Optoelectronic, Laser Diode Packaging, Radio Frequency (Rf) Device Packaging, Power Amplifier Packaging, Power Transistor Packaging), By Industry Vertical (Information Technology (IT) And Telecommunication, Consumer Electronics, Aerospace And Defense, Industrial, Automotive, Healthcare, Other Industry Vertical) – Impact of Tariff and Trade War on Market Size, Growth, Trends, and Forecast 2025–2034

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Ball Grid Array (BGA) Packaging Market Overview

• Ball Grid Array (BGA) Packaging market size has reached to $8.64 billion in 2024

• Expected to grow to $10.95 billion in 2029 at a compound annual growth rate (CAGR) of 5.1%

• Growth Driver: Expansion Of Consumer Electronics Driving Growth Of The Market Due To Rising Demand For Compact And High-Performance Devices

• Market Trend: Focus On Advanced Chip Substrate Development In The Market

Asia-Pacific was the largest region and fastest growing region.

What Is Covered Under Ball Grid Array (BGA) Packaging Market?

Ball grid array (BGA) packaging is a type of surface-mount packaging for integrated circuits that uses an array of small solder balls on the underside of the package for electrical connections. It offers high pin density, better electrical performance, improved heat dissipation, and a compact design, making it ideal for high-performance electronics.

The main types of ball grid array (BGA) packaging are molded array process BGA, thermally enhanced BGA, package on package (PoP) BGA, and micro BGA. Molded array process BGA is a packaging technology where encapsulation material is molded over the chip and substrate, enhancing durability, mechanical strength, and reliability for high-performance applications. The various materials include ceramic, plastic, and tape. These are applied in wafer-scale packaging, optoelectronics, laser diode packaging, radio frequency (RF) device packaging, power amplifier packaging, and power transistor packaging. These are also used by various industry verticals such as IT and telecommunications, consumer electronics, aerospace and defense, industrial, automotive, healthcare, and other industries.

Ball Grid Array (BGA) Packaging Market Size and growth rate 2025 to 2029: Graph

What Is The Ball Grid Array (BGA) Packaging Market Size 2025 And Growth Rate?

The ball grid array (BGA) packaging market size has grown strongly in recent years. It will grow from $8.64 billion in 2024 to $8.98 billion in 2025 at a compound annual growth rate (CAGR) of 4.0%. The growth in the historic period can be attributed to growth in demand for compact electronics, a rise in consumer electronics adoption, increased use in automotive electronics, expansion of telecom infrastructure, and a rise in industrial automation.

What Is The Ball Grid Array (BGA) Packaging Market Growth Forecast?

The ball grid array (BGA) packaging market size is expected to see strong growth in the next few years. It will grow to $10.95 billion in 2029 at a compound annual growth rate (CAGR) of 5.1%. The growth in the forecast period can be attributed to the proliferation of IoT devices, demand for high-speed connectivity, increasing data center investments, rising adoption of wearable technology, and expansion of electric vehicles. Major trends in the forecast period include the development of advanced packaging technologies, the integration of heterogeneous computing, the shift towards eco-friendly materials, the rise in AI-driven chip design, and advancements in AI and machine learning.

The forecast of 5.1% growth over the next five years reflects a modest reduction of 0.7% from the previous estimate for this market. This reduction is primarily due to the impact of tariffs between the US and other countries. This is likely to directly affect the US through tariff-induced disruptions in sourcing of substrate materials, solder balls, and advanced assembly equipment from Taiwan and South Korea, affecting semiconductor packaging efficiency. The effect will also be felt more widely due to reciprocal tariffs and the negative effect on the global economy and trade due to increased trade tensions and restrictions.

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What’s The Trade War Impact On Paper, Plastic, Rubber, Wood, And Textile Industry?

The quick escalation of U.S. tariffs and the resulting strain in trade relations in spring 2025 are considerably influencing the Paper, Plastics, Rubber, Wood And Textile sector by inflating costs for imported pulp, resin, synthetic rubber, lumber, and cotton key inputs with limited domestic substitutes. Packaging manufacturers, for example, now pay more for plastic films and corrugated materials, squeezing margins in an already price-sensitive market. Textile producers face similar challenges, as tariffs on imported yarns and dyes compound pressures from rising labor costs. Some firms are shifting to recycled materials or biodegradable alternatives, while others consolidate suppliers to negotiate bulk discounts.

How Is The Ball Grid Array (BGA) Packaging Market Segmented?

1) By Type: Molded Array Process Ball Grid Array (BGA), Thermally Enhanced Ball Grid Array (BGA), Package On Package (PoP) Ball Grid Array (BGA), Micro Ball Grid Array (BGA)

2) By Material: Ceramic, Plastic, Tape

3) By Application: Wafer Scale Packaging, Optoelectronic, Laser Diode Packaging, Radio Frequency (Rf) Device Packaging, Power Amplifier Packaging, Power Transistor Packaging

4) By Industry Vertical: Information Technology (IT) And Telecommunication, Consumer Electronics, Aerospace And Defense, Industrial, Automotive, Healthcare, Other Industry Vertical

Subsegments:

1) By Molded Array Process Ball Grid Array (BGA): Standard Molded Array Process Ball Grid Array (MAPBGA), Thin Molded Array Process Ball Grid Array (MAPBGA), Fine-Pitch Molded Array Process Ball Grid Array (MAPBGA)

2) By Thermally Enhanced Ball Grid Array (TEBGA): Copper Core Ball Grid Array (CCBGA), Metal Heat Spreader Ball Grid Array (MHSBGA), Embedded Heat Sink Ball Grid Array (EHSBGA)

3) By Package On Package Ball Grid Array (PoP BGA): Stacked Die Package On Package Ball Grid Array (PoP BGA), Memory-On-Logic Package On Package Ball Grid Array (PoP BGA), Logic-On-Logic Package On Package Ball Grid Array (PoP BGA)

4) By Micro Ball Grid Array (µBGA): Ultra-Fine Pitch Micro Ball Grid Array (µBGA), Wafer-Level Micro Ball Grid Array (µBGA), Chip-Scale Micro Ball Grid Array (µBGA)

What Is Driving The Ball Grid Array (BGA) Packaging Market? Expansion Of Consumer Electronics Driving Growth Of The Market Due To Rising Demand For Compact And High-Performance Devices

The growing consumer electronics sector is expected to propel the growth of the ball grid array (BGA) packaging market going forward. The consumer electronics sector refers to the industry that designs, manufactures, and sells electronic devices intended for everyday consumer use. The demand for consumer electronics is rising as consumers are showing interest in sustainable and smart energy-saving gadgets, driving innovation in eco-friendly materials, energy-efficient designs, and smart technology integration for reduced environmental impact. Ball grid array (BGA) packaging enhances the consumer electronics sector by enabling higher component density, improved electrical performance, and better heat dissipation, supporting the development of compact, high-performance devices. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, Japan's electronic equipment production totaled 771,457 units, with consumer electronics manufacturing reaching 32,099 units, up from 25,268 units in May 2022. Therefore, the growing consumer electronics sector is driving the growth of the ball grid array (BGA) packaging industry.

Who Are The Major Players In The Global Ball Grid Array (BGA) Packaging Market?

Major companies operating in the ball grid array (BGA) packaging market are Intel Corporation, Qualcomm, Micron Technology, Toshiba, ASE Technology Holding Co. Ltd., Infineon Technologies AG, Amkor Technology, Unimicron Technology, Samsung Electronics, Ibiden Co. Ltd., TTM Technologies Inc., Nanya PCB, Jiangsu Changjiang Electronics Technology Co., Micro Systems Engineering GmbH, Palomar Technologies, INDIC - EMS Electronics Pvt. Ltd., Cirexx International, Naprotek LLC, Delphon, Advanced Interconnections Inc.

What Are The Key Trends Of The Global Ball Grid Array (BGA) Packaging Market? Focus On Advanced Chip Substrate Development In The Market

Major companies operating in the ball grid array (BGA) packaging market are focusing on developing innovative products such as chip substrate to enhance performance, improve thermal management, and support advanced semiconductor applications. A chip substrate is the base layer in semiconductor packaging that connects an integrated circuit (IC) chip to a printed circuit board (PCB). It provides mechanical support, electrical connections, and thermal dissipation for the chip. For instance, in February 2023, Samsung Electronics Co. Ltd., a Korea-based technology company, launched advanced flip-chip ball grid array (FC-BGA) substrate designed for autonomous driving. It is a high-performance flip-chip ball grid array (FC-BGA) substrate designed to connect high-density semiconductor chips to the mainboard for efficient electrical signal and power transmission. This advanced packaging solution enhances chip performance by reducing latency, improving thermal management, and enabling faster data processing.

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What Are Latest Mergers And Acquisitions In The Ball Grid Array (BGA) Packaging Market? AMD Acquires Xilinx To Enhance Product Portfolio And Leadership In High-Performance Adaptive Computing, Expanding BGA Packaging Capabilities

In February 2022, Advanced Micro Devices, Inc., a US-based semiconductor company, acquired Xilinx, Inc. for an undisclosed amount. With this acquisition, AMD aims to create a high-performance and adaptive computing by integrating Xilinx’s industry-leading FPGAs, adaptive SoCs, and AI engines with AMD’s CPUs and GPUs, expanding market opportunities and enhancing its computing capabilities. Xilinx Inc. is a US-based semiconductor company that provides ball grid array (BGA) packaging for their semiconductor devices.

What Is The Regional Outlook For The Global Ball Grid Array (BGA) Packaging Market?

Asia-Pacific was the largest region in the ball grid array (BGA) packaging market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in this market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in this market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

What Defines the Ball Grid Array (BGA) Packaging Market?

The ball grid array (BGA) packaging market consists of revenues earned by entities by providing services such as BGA packaging design and development, BGA assembly and soldering services, BGA testing and inspection, and BGA substrate manufacturing. The market value includes the value of related goods sold by the service provider or included within the service offering. The ball grid array (BGA) packaging market also includes sales of flip-chip ball grid array (FCBGA), ceramic ball grid array (CBGA), tape ball grid array (TBGA), and plastic ball grid array (PBGA). Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

How is Market Value Defined and Measured?

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

What is the Market Assessment and Strategic Outlook for the Ball Grid Array (BGA) Packaging Industry?

The ball grid array (bga) packaging market research report is one of a series of new reports from The Business Research Company that provides market statistics, including industry global market size, regional shares, competitors with the market share, detailed market segments, market trends and opportunities, and any further data you may need to thrive in the ball grid array (bga) packaging industry. The market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future state of the industry.

Author : Girish Kavali

Ball Grid Array BGA Packaging Market Report Forecast Analysis

Report AttributeDetails
Market Size Value In 2025 $8.98 billion
Revenue Forecast In 2034 $10.95 billion
Growth Rate CAGR of 5.1% from 2025 to 2034
Base Year For Estimation 2024
Actual Estimates/Historical Data 2019-2024
Forecast Period 2025 - 2029 - 2034
Market Representation Revenue in USD Billion and CAGR from 2025 to 2034
Segments Covered The ball grid array (BGA) packaging market covered in this report is segmented –
1) By Type: Molded Array Process Ball Grid Array (BGA), Thermally Enhanced Ball Grid Array (BGA), Package On Package (PoP) Ball Grid Array (BGA), Micro Ball Grid Array (BGA)
2) By Material: Ceramic, Plastic, Tape
3) By Application: Wafer Scale Packaging, Optoelectronic, Laser Diode Packaging, Radio Frequency (Rf) Device Packaging, Power Amplifier Packaging, Power Transistor Packaging
4) By Industry Vertical: Information Technology (IT) And Telecommunication, Consumer Electronics, Aerospace And Defense, Industrial, Automotive, Healthcare, Other Industry Vertical Subsegments:
1) By Molded Array Process Ball Grid Array (BGA): Standard Molded Array Process Ball Grid Array (MAPBGA), Thin Molded Array Process Ball Grid Array (MAPBGA), Fine-Pitch Molded Array Process Ball Grid Array (MAPBGA)
2) By Thermally Enhanced Ball Grid Array (TEBGA): Copper Core Ball Grid Array (CCBGA), Metal Heat Spreader Ball Grid Array (MHSBGA), Embedded Heat Sink Ball Grid Array (EHSBGA)
3) By Package On Package Ball Grid Array (PoP BGA): Stacked Die Package On Package Ball Grid Array (PoP BGA), Memory-On-Logic Package On Package Ball Grid Array (PoP BGA), Logic-On-Logic Package On Package Ball Grid Array (PoP BGA)
4) By Micro Ball Grid Array (µBGA): Ultra-Fine Pitch Micro Ball Grid Array (µBGA), Wafer-Level Micro Ball Grid Array (µBGA), Chip-Scale Micro Ball Grid Array (µBGA)
Regional Scope Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa
Country Scope The countries covered in the report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain. Additional countries that can be covered in the report are Bangladesh, Thailand, Vietnam, Malaysia, Singapore, Philippines, Hong Kong, New Zealand, Mexico, Chile, Argentina, Colombia, Peru, Austria, Belgium, Denmark, Finland, Ireland, Netherlands, Norway, Portugal, Sweden, Switzerland, Czech Republic, Poland, Romania, Ukraine, Saudi Arabia, Israel, Iran, Turkey, UAE, Egypt, Nigeria, South Africa.
Key Companies Profiled Intel Corporation, Qualcomm, Micron Technology, Toshiba, ASE Technology Holding Co. Ltd., Infineon Technologies AG, Amkor Technology, Unimicron Technology, Samsung Electronics, Ibiden Co. Ltd., TTM Technologies Inc., Nanya PCB, Jiangsu Changjiang Electronics Technology Co., Micro Systems Engineering GmbH, Palomar Technologies, INDIC - EMS Electronics Pvt. Ltd., Cirexx International, Naprotek LLC, Delphon, Advanced Interconnections Inc.
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Table Of Contents

1. Executive Summary

2. Ball Grid Array (BGA) Packaging Market Characteristics

3. Ball Grid Array (BGA) Packaging Market Trends And Strategies

4. Ball Grid Array (BGA) Packaging Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, And Covid And Recovery On The Market

4.1. Supply Chain Impact from Tariff War & Trade Protectionism

5. Global Ball Grid Array (BGA) Packaging Growth Analysis And Strategic Analysis Framework

5.1. Global Ball Grid Array (BGA) Packaging PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)

5.2. Analysis Of End Use Industries

5.3. Global Ball Grid Array (BGA) Packaging Market Growth Rate Analysis

5.4. Global Ball Grid Array (BGA) Packaging Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)

5.5. Global Ball Grid Array (BGA) Packaging Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)

5.6. Global Ball Grid Array (BGA) Packaging Total Addressable Market (TAM)

6. Ball Grid Array (BGA) Packaging Market Segmentation

6.1. Global Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

Molded Array Process Ball Grid Array (BGA)

Thermally Enhanced Ball Grid Array (BGA)

Package On Package (PoP) Ball Grid Array (BGA)

Micro Ball Grid Array (BGA)

6.2. Global Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

Ceramic

Plastic

Tape

6.3. Global Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

Wafer Scale Packaging

Optoelectronic

Laser Diode Packaging

Radio Frequency (Rf) Device Packaging

Power Amplifier Packaging

Power Transistor Packaging

6.4. Global Ball Grid Array (BGA) Packaging Market, Segmentation By Industry Vertical, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

Information Technology (IT) And Telecommunication

Consumer Electronics

Aerospace And Defense

Industrial

Automotive

Healthcare

Other Industry Vertical

6.5. Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Molded Array Process Ball Grid Array (BGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

Standard Molded Array Process Ball Grid Array (MAPBGA)

Thin Molded Array Process Ball Grid Array (MAPBGA)

Fine-Pitch Molded Array Process Ball Grid Array (MAPBGA)

6.6. Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Thermally Enhanced Ball Grid Array (TEBGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

Copper Core Ball Grid Array (CCBGA)

Metal Heat Spreader Ball Grid Array (MHSBGA)

Embedded Heat Sink Ball Grid Array (EHSBGA)

6.7. Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Package On Package Ball Grid Array (PoP BGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

Stacked Die Package On Package Ball Grid Array (PoP BGA)

Memory-On-Logic Package On Package Ball Grid Array (PoP BGA)

Logic-On-Logic Package On Package Ball Grid Array (PoP BGA)

6.8. Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Micro Ball Grid Array (µBGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

Ultra-Fine Pitch Micro Ball Grid Array (µBGA)

Wafer-Level Micro Ball Grid Array (µBGA)

Chip-Scale Micro Ball Grid Array (µBGA)

7. Ball Grid Array (BGA) Packaging Market Regional And Country Analysis

7.1. Global Ball Grid Array (BGA) Packaging Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

7.2. Global Ball Grid Array (BGA) Packaging Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Ball Grid Array (BGA) Packaging Market

8.1. Asia-Pacific Ball Grid Array (BGA) Packaging Market Overview

Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies

8.2. Asia-Pacific Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8.3. Asia-Pacific Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8.4. Asia-Pacific Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Ball Grid Array (BGA) Packaging Market

9.1. China Ball Grid Array (BGA) Packaging Market Overview

9.2. China Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

9.3. China Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

9.4. China Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Ball Grid Array (BGA) Packaging Market

10.1. India Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

10.2. India Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

10.3. India Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Ball Grid Array (BGA) Packaging Market

11.1. Japan Ball Grid Array (BGA) Packaging Market Overview

11.2. Japan Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11.3. Japan Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11.4. Japan Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Ball Grid Array (BGA) Packaging Market

12.1. Australia Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12.2. Australia Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12.3. Australia Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Ball Grid Array (BGA) Packaging Market

13.1. Indonesia Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13.2. Indonesia Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13.3. Indonesia Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Ball Grid Array (BGA) Packaging Market

14.1. South Korea Ball Grid Array (BGA) Packaging Market Overview

14.2. South Korea Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14.3. South Korea Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14.4. South Korea Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Ball Grid Array (BGA) Packaging Market

15.1. Western Europe Ball Grid Array (BGA) Packaging Market Overview

15.2. Western Europe Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15.3. Western Europe Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15.4. Western Europe Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Ball Grid Array (BGA) Packaging Market

16.1. UK Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16.2. UK Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16.3. UK Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Ball Grid Array (BGA) Packaging Market

17.1. Germany Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17.2. Germany Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17.3. Germany Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Ball Grid Array (BGA) Packaging Market

18.1. France Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18.2. France Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18.3. France Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Ball Grid Array (BGA) Packaging Market

19.1. Italy Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19.2. Italy Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19.3. Italy Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Ball Grid Array (BGA) Packaging Market

20.1. Spain Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20.2. Spain Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20.3. Spain Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Ball Grid Array (BGA) Packaging Market

21.1. Eastern Europe Ball Grid Array (BGA) Packaging Market Overview

21.2. Eastern Europe Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21.3. Eastern Europe Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21.4. Eastern Europe Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Ball Grid Array (BGA) Packaging Market

22.1. Russia Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22.2. Russia Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22.3. Russia Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Ball Grid Array (BGA) Packaging Market

23.1. North America Ball Grid Array (BGA) Packaging Market Overview

23.2. North America Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23.3. North America Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23.4. North America Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Ball Grid Array (BGA) Packaging Market

24.1. USA Ball Grid Array (BGA) Packaging Market Overview

24.2. USA Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24.3. USA Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24.4. USA Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Ball Grid Array (BGA) Packaging Market

25.1. Canada Ball Grid Array (BGA) Packaging Market Overview

25.2. Canada Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25.3. Canada Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25.4. Canada Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Ball Grid Array (BGA) Packaging Market

26.1. South America Ball Grid Array (BGA) Packaging Market Overview

26.2. South America Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26.3. South America Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26.4. South America Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Ball Grid Array (BGA) Packaging Market

27.1. Brazil Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27.2. Brazil Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27.3. Brazil Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Ball Grid Array (BGA) Packaging Market

28.1. Middle East Ball Grid Array (BGA) Packaging Market Overview

28.2. Middle East Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28.3. Middle East Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28.4. Middle East Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Ball Grid Array (BGA) Packaging Market

29.1. Africa Ball Grid Array (BGA) Packaging Market Overview

29.2. Africa Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29.3. Africa Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29.4. Africa Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Ball Grid Array (BGA) Packaging Market Competitive Landscape And Company Profiles

30.1. Ball Grid Array (BGA) Packaging Market Competitive Landscape

30.2. Ball Grid Array (BGA) Packaging Market Company Profiles

30.2.1. Intel Corporation Overview, Products and Services, Strategy and Financial Analysis

30.2.2. Qualcomm Overview, Products and Services, Strategy and Financial Analysis

30.2.3. Micron Technology Overview, Products and Services, Strategy and Financial Analysis

30.2.4. Toshiba Overview, Products and Services, Strategy and Financial Analysis

30.2.5. ASE Technology Holding Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis

31. Ball Grid Array (BGA) Packaging Market Other Major And Innovative Companies

31.1. Infineon Technologies AG

31.2. Amkor Technology

31.3. Unimicron Technology

31.4. Samsung Electronics

31.5. Ibiden Co. Ltd.

31.6. TTM Technologies Inc.

31.7. Nanya PCB

31.8. Jiangsu Changjiang Electronics Technology Co.

31.9. Micro Systems Engineering GmbH

31.10. Palomar Technologies

31.11. INDIC - EMS Electronics Pvt. Ltd.

31.12. Cirexx International

31.13. Naprotek LLC

31.14. Delphon

31.15. Advanced Interconnections Inc.

32. Global Ball Grid Array (BGA) Packaging Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Ball Grid Array (BGA) Packaging Market

34. Recent Developments In The Ball Grid Array (BGA) Packaging Market

35. Ball Grid Array (BGA) Packaging Market High Potential Countries, Segments and Strategies

35.1 Ball Grid Array (BGA) Packaging Market In 2029 - Countries Offering Most New Opportunities

35.2 Ball Grid Array (BGA) Packaging Market In 2029 - Segments Offering Most New Opportunities

35.3 Ball Grid Array (BGA) Packaging Market In 2029 - Growth Strategies

35.3.1 Market Trend Based Strategies

35.3.2 Competitor Strategies

36. Appendix

36.1. Abbreviations

36.2. Currencies

36.3. Historic And Forecast Inflation Rates

36.4. Research Inquiries

36.5. The Business Research Company

36.6. Copyright And Disclaimer

List Of Tables

    Table 1: Global Historic Market Growth, 2019-2024, $ Billion
  • Table 2: Global Forecast Market Growth, 2024-2029F, 2034F, $ Billion
  • Table 3: Global Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 4: Global Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 5: Global Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 6: Global Ball Grid Array (BGA) Packaging Market, Segmentation By Industry Vertical, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 7: Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Molded Array Process Ball Grid Array (BGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 8: Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Thermally Enhanced Ball Grid Array (TEBGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 9: Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Package On Package Ball Grid Array (PoP BGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 10: Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Micro Ball Grid Array (µBGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 11: Global Ball Grid Array (BGA) Packaging Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 12: Global Ball Grid Array (BGA) Packaging Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 13: Asia-Pacific, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 14: Asia-Pacific, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 15: Asia-Pacific, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 16: China, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 17: China, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 18: China, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 19: India, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 20: India, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 21: India, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 22: Japan, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 23: Japan, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 24: Japan, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 25: Australia, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 26: Australia, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 27: Australia, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 28: Indonesia, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 29: Indonesia, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 30: Indonesia, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 31: South Korea, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 32: South Korea, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 33: South Korea, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 34: Western Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 35: Western Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 36: Western Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 37: UK, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 38: UK, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 39: UK, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 40: Germany, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 41: Germany, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 42: Germany, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 43: France, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 44: France, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 45: France, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 46: Italy, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 47: Italy, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 48: Italy, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 49: Spain, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 50: Spain, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 51: Spain, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 52: Eastern Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 53: Eastern Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 54: Eastern Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 55: Russia, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 56: Russia, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 57: Russia, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 58: North America, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 59: North America, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 60: North America, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 61: USA, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 62: USA, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 63: USA, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 64: Canada, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 65: Canada, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 66: Canada, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 67: South America, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 68: South America, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 69: South America, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 70: Brazil, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 71: Brazil, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 72: Brazil, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 73: Middle East, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 74: Middle East, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 75: Middle East, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 76: Africa, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 77: Africa, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 78: Africa, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Table 79: Intel Corporation Financial Performance
  • Table 80: Qualcomm Financial Performance
  • Table 81: Micron Technology Financial Performance
  • Table 82: Toshiba Financial Performance
  • Table 83: ASE Technology Holding Co. Ltd. Financial Performance

List Of Figures

    Figure 1: Global Historic Market Growth, 2019-2024, $ Billion
  • Figure 2: Global Forecast Market Growth, 2024-2029F, 2034F, $ Billion
  • Figure 3: Global Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 4: Global Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 5: Global Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 6: Global Ball Grid Array (BGA) Packaging Market, Segmentation By Industry Vertical, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 7: Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Molded Array Process Ball Grid Array (BGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 8: Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Thermally Enhanced Ball Grid Array (TEBGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 9: Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Package On Package Ball Grid Array (PoP BGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 10: Global Ball Grid Array (BGA) Packaging Market, Sub-Segmentation Of Micro Ball Grid Array (µBGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 11: Global Ball Grid Array (BGA) Packaging Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 12: Global Ball Grid Array (BGA) Packaging Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 13: Asia-Pacific, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 14: Asia-Pacific, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 15: Asia-Pacific, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 16: China, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 17: China, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 18: China, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 19: India, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 20: India, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 21: India, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 22: Japan, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 23: Japan, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 24: Japan, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 25: Australia, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 26: Australia, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 27: Australia, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 28: Indonesia, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 29: Indonesia, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 30: Indonesia, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 31: South Korea, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 32: South Korea, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 33: South Korea, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 34: Western Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 35: Western Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 36: Western Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 37: UK, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 38: UK, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 39: UK, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 40: Germany, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 41: Germany, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 42: Germany, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 43: France, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 44: France, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 45: France, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 46: Italy, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 47: Italy, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 48: Italy, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 49: Spain, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 50: Spain, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 51: Spain, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 52: Eastern Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 53: Eastern Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 54: Eastern Europe, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 55: Russia, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 56: Russia, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 57: Russia, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 58: North America, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 59: North America, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 60: North America, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 61: USA, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 62: USA, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 63: USA, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 64: Canada, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 65: Canada, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 66: Canada, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 67: South America, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 68: South America, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 69: South America, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 70: Brazil, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 71: Brazil, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 72: Brazil, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 73: Middle East, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 74: Middle East, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 75: Middle East, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 76: Africa, Ball Grid Array (BGA) Packaging Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 77: Africa, Ball Grid Array (BGA) Packaging Market, Segmentation By Material, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 78: Africa, Ball Grid Array (BGA) Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Figure 79: Intel Corporation Financial Performance
  • Figure 80: Qualcomm Financial Performance
  • Figure 81: Micron Technology Financial Performance
  • Figure 82: Toshiba Financial Performance
  • Figure 83: ASE Technology Holding Co. Ltd. Financial Performance

Frequently Asked Questions

Ball grid array (BGA) packaging is a type of surface-mount packaging for integrated circuits that uses an array of small solder balls on the underside of the package for electrical connections. It offers high pin density, better electrical performance, improved heat dissipation, and a compact design, making it ideal for high-performance electronics. For further insights on this market, request a sample here

The market major growth driver - Expansion Of Consumer Electronics Driving Growth Of The Market Due To Rising Demand For Compact And High-Performance Devices. For further insights on this market, request a sample here

The ball grid array (bga) packaging market size has grown steadily in recent years. It will grow from $8.64 billion in 2024 to $8.98 billion in 2025 at a compound annual growth rate (CAGR) of 4.0%. The growth in the historic period can be attributed to growth in demand for compact electronics, a rise in consumer electronics adoption, increased use in automotive electronics, expansion of telecom infrastructure, and a rise in industrial automation. The ball grid array (bga) packaging market size is expected to see strong growth in the next few years. It will grow to $10.95 billion in 2029 at a compound annual growth rate (CAGR) of 5.1%. The growth in the forecast period can be attributed to the proliferation of IoT devices, demand for high-speed connectivity, increasing data center investments, rising adoption of wearable technology, and expansion of electric vehicles. Major trends in the forecast period include the development of advanced packaging technologies, the integration of heterogeneous computing, the shift towards eco-friendly materials, the rise in AI-driven chip design, and advancements in AI and machine learning. For further insights on this market, request a sample here

The ball grid array (bga) packaging market covered in this report is segmented –
1) By Type: Molded Array Process Ball Grid Array (BGA), Thermally Enhanced Ball Grid Array (BGA), Package On Package (PoP) Ball Grid Array (BGA), Micro Ball Grid Array (BGA)
2) By Material: Ceramic, Plastic, Tape
3) By Application: Wafer Scale Packaging, Optoelectronic, Laser Diode Packaging, Radio Frequency (Rf) Device Packaging, Power Amplifier Packaging, Power Transistor Packaging
4) By Industry Vertical: Information Technology (IT) And Telecommunication, Consumer Electronics, Aerospace And Defense, Industrial, Automotive, Healthcare, Other Industry Vertical Subsegments:
1) By Molded Array Process Ball Grid Array (BGA): Standard Molded Array Process Ball Grid Array (MAPBGA), Thin Molded Array Process Ball Grid Array (MAPBGA), Fine-Pitch Molded Array Process Ball Grid Array (MAPBGA)
2) By Thermally Enhanced Ball Grid Array (TEBGA): Copper Core Ball Grid Array (CCBGA), Metal Heat Spreader Ball Grid Array (MHSBGA), Embedded Heat Sink Ball Grid Array (EHSBGA)
3) By Package On Package Ball Grid Array (PoP BGA): Stacked Die Package On Package Ball Grid Array (PoP BGA), Memory-On-Logic Package On Package Ball Grid Array (PoP BGA), Logic-On-Logic Package On Package Ball Grid Array (PoP BGA)
4) By Micro Ball Grid Array (µBGA): Ultra-Fine Pitch Micro Ball Grid Array (µBGA), Wafer-Level Micro Ball Grid Array (µBGA), Chip-Scale Micro Ball Grid Array (µBGA) For further insights on this market,
request a sample here

Asia-Pacific was the largest region in the ball grid array (BGA) packaging market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the ball grid array (BGA) packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. For further insights on this market, request a sample here.

Major companies operating in the ball grid array (BGA) packaging market are Intel Corporation, Qualcomm, Micron Technology, Toshiba, ASE Technology Holding Co. Ltd., Infineon Technologies AG, Amkor Technology, Unimicron Technology, Samsung Electronics, Ibiden Co. Ltd., TTM Technologies Inc., Nanya PCB, Jiangsu Changjiang Electronics Technology Co., Micro Systems Engineering GmbH, Palomar Technologies, INDIC - EMS Electronics Pvt. Ltd., Cirexx International, Naprotek LLC, Delphon, Advanced Interconnections Inc. . For further insights on this market, request a sample here.

Major trends in this market include Focus On Advanced Chip Substrate Development In The Market. For further insights on this market, request a sample here.

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