The Interconnect And Passive Components Market Overview 2025 report reveals that the market size has grown significantly over the past few years, with projections indicating further expansion.
The market size of interconnect and passive components has significantly expanded over the years. The market is forecasted to rise from $202.24 billion in 2024 to $216.26 billion in 2025, exhibiting a compound annual growth rate (CAGR) of 6.9%.
The Interconnect and Passive Components market is forecasted to grow to $275.57 billion in 2029, with a compound annual growth rate (CAGR) of 6.2%.
Download Your Free Sample of the 2025 Interconnect And Passive Components Market Report and Uncover Key Trends Now!The key drivers in the interconnect and passive components market are:
• Rollout of 5G network technology
• Growth and expansion of electric vehicle (EV) sector
• Rapid expansion of internet of things (IoT)
• Increasing growth in the aerospace and defense sector
The interconnect and passive components market covered in this report is segmented –
1) By Product: Passive Components, Interconnects
2) By Application: Consumer Electronics, Data Processing, Telecommunication, Military And Aerospace, Automotive, Industrial, Healthcare
The key trends in the interconnect and passive components market are:
• Miniaturization and technology advancements are emerging trends in the market.
• High-frequency and RF components are increasingly shaping the market's future.
• There's a growing shift towards sustainable and eco-friendly components.
• Customization and the development of modular designs are also trending upwards.
Major companies in the interconnect and passive components market are:
• Foxconn Electronics Inc.
• Nichicon Corporation
• Koch Industries Inc.
• Panasonic Corporation
• Cisco Systems Inc.
• KYOCERA AVX Components Corporation
• TE Connectivity Corporation
• TDK Corporation
• Molex Incorporated
• YAZAKI Corporation
• Amphenol Corporation
• Murata Manufacturing Co. Ltd.
• Samsung Electro-Mechanics Co. Ltd.
• AMETEK Inc.
• Hubbell Inc.
• Delphi Technologies PLC
• Yageo Corporation
• Vishay Intertechnology Inc.
• Bourns Inc.
• Taiyo Yuden Co. Ltd.
• Japan Aviation Electronics Industry Ltd.
• KEMET Electronics Corporation
• HIROSE ELECTRIC CO.
• Sumida Corporation
• TT Electronics PLC
• Rubycon Corporation
• Pulse Electronics Corporation
• J.S.T. Mfg. Co.
• Chogori Technology Co. Ltd.
• Zeeteq Electronics Co. Ltd.
Asia-Pacific was the largest region in the interconnect and passive components market in 2024