The Molded Interconnect Device (MID) Market Overview 2025 report reveals that the market size has grown significantly over the past few years, with projections indicating further expansion.
What are the Historical Growth Trends in the Molded Interconnect Device (MID) Market?
The market for Molded Interconnect Device (MID) has seen substantial growth recently. It is anticipated to expand from $1.75 billion in 2024 to about $2.03 billion in 2025, with a Compound Annual Growth Rate (CAGR) of 16.4%.
What are the 2025 Market Projections: Forecasted Size & Growth Rate for the Molded Interconnect Device (MID) Industry?
The Molded Interconnect Device (MID) market is projected to reach a value of $3.7 billion in 2029, growing at a compound annual growth rate (CAGR) of 16.2%.
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What are the Key Growth Drivers Fueling the Molded Interconnect Device (MID) Market?
The key drivers in the molded interconnect device (mid) market are:
• Ongoing evolution of consumer electronics
• Rise in medical device integration
• Growth in automotive electronics
• Innovations in rapid prototyping and manufacturing
Global Market Segmentation: Identifying Major Molded Interconnect Device (MID) Industry Segments
The molded interconnect device (MID) market covered in this report is segmented –
1) By Product: Antenna And Connectivity Modules, Connectors And Switches, Sensors, Lighting
2) By Process: Laser Direct Structuring (LDS), Two-Shot Molding, Other Processes
3) By Application: Automotive, Consumer Products, Healthcare, Industrial, Military And Aerospace, Telecommunication And Computing
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What are the Emerging Trends Shaping the Future of the Molded Interconnect Device (MID) Market?
The key trends in the molded interconnect device (mid) market are:
• The future of the MID market is significantly influenced by regulatory compliance and quality standards.
• Customization and design flexibility are increasingly shaping the market's growth.
• Rapid prototyping and manufacturing technologies are emerging trends in the MID market.
• Sustainability, material innovations, industry 4.0 and smart manufacturing are defining trends for the future.
Who Are the Top Competitors & Leading Players in the Molded Interconnect Device (MID) Market?
Major companies in the molded interconnect device (mid) market are:
• Molex LLC
• TE Connectivity Ltd.
• Amphenol Corporation
• LPKF Laser & Electronics AG
• 2E mechatronic GmbH & Co. KG
• Harting Technologiegruppe
• Arlington Plating Company
• MID Solutions LLC
• MacDermid Inc.
• JOHNAN Corporation
• TactoTek Oy
• Axon' Cable S.A.S
• S2P Solutions
• Suzhou Cicor Technology Co. Ltd
• Chogori Technology Co. Ltd.
• Mitsubishi Engineering-Plastics Corporation
• Galtronics Corporation Ltd.
• RTP Company
• BASF SE
• EMS-Chemie Holding AG
• Ensinger GmbH
• Zeon Corporation
• SelectConnect Technologies
• Multiple Dimensions AG
• Cicor Group
• Tesa SE
• Yomura Technologies Inc.
• T-Ink Inc.
• ODU GmbH & Co. KG
Regional Dominance: Which Area Leads the Global Template Market?
Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2024
