The Thermal Interface Materials Market Overview 2025 report reveals that the market size has grown significantly over the past few years, with projections indicating further expansion.
The market size of the Thermal Interface Materials Global Market Report has seen a quick expansion in recent years. The market which was valued at $2.8 billion in 2024, is projected to rise to $3.14 billion in 2025, with a compound annual growth rate (CAGR) of 12.1%.
The Thermal Interface Materials Global Market is projected to reach a market size of $4.86 billion in 2029, growing at a compound annual growth rate (CAGR) of 11.5%.
Download Your Free Sample of the 2025 Thermal Interface Materials Market Report and Uncover Key Trends Now!The key drivers in the thermal interface materials market are:
• Rapid proliferation of electric vehicles
• Advancement in renewable energy technologies
• Innovation in medical device manufacturing
• Expansion of AI and IoT technologies
The thermal interface materials market covered in this report is segmented –
1) By Type: Greases & Adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs, Phase Change Materials, Other Types
2) By Chemistry: Silicone, Epoxy, Polyimide, Other Chemistries
3) By Application: Telecom, Computer, Medical Devices, Industrial Machinery, Consumer Durables, Automotive Electronics, Other Applications
The key trends in the online on-demand home services market are:
• Advanced bonding technologies are becoming increasingly popular in the thermal interface materials market.
• There is a growing trend towards the use of thermal gap fillers.
• Innovations in TIM packaging are shaping the future of the market.
• The use of thermal management simulation and nanomaterial integration are upcoming trends.
Major companies in the thermal interface materials market are:
• The 3M Company
• Zalman Tech Co. Ltd.
• Indium Corporation
• The Berquist Company Inc.
• Momentive Performance Materials Inc.
• Laird Technologies Inc.
• DOW Corning Corporation
• Parker Hannifin Corporation
• Henkel AG & Co. KGAA
• Fujipoly Industries Co Ltd.
• DK Thermal Metal Circuit Technology Ltd.
• AI Technology Inc.
• AIM Specialty Materials
• AOS Thermal Compounds LLC.
• Denka Company Limited.
• Universal Science
• Dymax Corporation
• Ellsworth Adhesives
• Enerdyne Devices Private Limited.
• European Thermodynamics Ltd
• Inkron Oy
• Kitagawa Industries
• LORD
• M. A. Electronics Private Limited.
• MH&W International Corporation.
• Minerals Technologies Inc.
• Chomerics Inc.
• Robnor ResinLab Ltd.
• Schlegel Electronics Materials
• Honeywell International Inc.
• Panasonic Corporation
• Advanced Thermal Solutions Inc.
• MG Chemicals
• Thermal Grizzly
• Aavid Thermalloy LLC
• Arctic Silver Inc.
• Thermalright Inc.
• Cooler Master Co. Ltd.
• GELID Solutions Ltd.
• Master Bond Inc.
• Kerafol Keramische Folien GmbH & Co. KG
Asia-Pacific was the largest region in the thermal interface materials market in 2024