The atomic layer deposition market has seen considerable growth due to a variety of factors.
• The atomic layer deposition market size has experienced significant expansion in the past few years. There will be a rise from $2.97 billion in 2024 to $3.22 billion in 2025 with a compound annual growth rate (CAGR) of 8.6%. The development during the historic period was due to growth in the semiconductor industry, R&D investments, advancements in miniaturization, enhancement in applications, material innovation, and global expansion.
The Atomic Layer Deposition market is expected to maintain its strong growth trajectory in upcoming years.
• The market size of atomic layer deposition is projected to witness significant expansion in the coming years, escalating to $4.53 billion by 2029 with a compound annual growth rate (CAGR) of 8.9%.
This surge during the forecast period can be credited to breakthroughs in medical device technology, incorporation of AI and machine learning, advances in energy storage solutions, strategic partnerships, and regulatory backup. Key trends for the forecast period include progress in nanotechnology, emphasis on energy storage, international expansion of ALD equipment producers, the introduction of new application integrations of ALD in 3D NAND technology, and technological revolutions.
The rise in the need for semiconductor chips is set to boost the expansion of the atomic layer deposition market. An electric circuit with elements such as transistors and wiring embedded on a semiconductor wafer is what a semiconductor chip entails. The fabrication process of semiconductor chips and devices employs atomic layer deposition (ALD) to layer semiconductors onto another semiconductor surface, thereby diminishing or substituting the requirement for patterning stages. For example, the Semiconductor Industry Association (SIA), a trade body based in the US that represents the country's semiconductor sector, reported that worldwide sales in the semiconductor industry rose by 3.2 percent, moving from $555.9 billion in 2021 to $573.5 billion in 2022. Subsequently, the escalating demand for semiconductor chips is fostering the growth of the atomic layer deposition market.
The atomic layer deposition market covered in this report is segmented –
1) By Type: Metal ALD, Aluminum Oxide ALD, Plasma Enhanced ALD, Catalytic ALD, Other Types
2) By Process: Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD)
3) By End User: Semiconductors And Electronics, Chemicals, Energy, Healthcare, Other End Users
Subsegments:
1) By Metal ALD: Cobalt ALD, Ruthenium ALD, Platinum ALD, Other Metal ALD
2) By Aluminum Oxide ALD: Aluminum Oxide Thin Films, Aluminum Oxide Nanostructures
3) By Plasma Enhanced ALD: Remote Plasma Enhanced ALD, Direct Plasma Enhanced ALD
4) By Catalytic ALD: Catalytic Layer Deposition For Nanostructures, Catalytic Layer Deposition For Sensors
5) By Other Types: Oxide ALD, Nitride ALD, Hybrid ALD
The atomic layer deposition market is currently witnessing an upward trend in product innovation. Key players in this market are concentrating their efforts on creating atomic layer deposition platforms designed for new applications. Samco Inc., a semiconductor process equipment manufacturer based in Japan, is one such entity that introduced a plasma-enhanced atomic layer deposition (PEALD) system, AD-800LP, in October 2022. The system primarily aims to deposit gate oxide films for future silicon carbide (SiC) and gallium nitride (GaN) power appliances, a crucial element in the shift towards carbon neutrality. Besides its traditional thermal ALD functionality, the AD-800LP system is a versatile R&D device equipped with a specialized ICP plasma source called Tornado ICP. This exclusive technology from Samco, different from remote plasma, supports the deposition of various films through the AD-800LP, encompassing oxide and nitride films. Furthermore, Tornado ICP ensures constant plasma discharge for ALD deposition, even under high pressure conditions.
Major companies operating in the atomic layer deposition market include:
• Arradiance LLC
• ASM International N.V.
• Beneq Oy
• Denton Vacuum LLC
• Entegris Inc.
• Kurt J. Lesker Company
• Lam Research Corporation.
• Oxford Instruments PLC
• Tokyo Electron Limited
• Veeco Instruments Inc.
• ALD NanoSolutions Inc.
• Forge Nano Inc.
• Adeka Corporation
• Jiangsu Leadmicro Guide Nano Equipment Technology Co. Ltd.
• Encapsulix
• NCD Co. Ltd.
• Applied Materials Inc.
• AIXTRON AG
• EV Group
• PVD Products Inc.
• Semilab Semiconductor Physics Laboratory Co. Ltd.
• KLA Corporation
• Bruker Corporation
• Hitachi High-Technologies Corporation
• Nikon Corporation
• Canon Inc.
• Toshiba Corporation
• Sony Corporation
• Panasonic Corporation
• Moorfield Group Ltd.
Asia-Pacific was the largest region in the atomic layer deposition market in 2024. Asia-Pacific is expected to be the fastest-growing region in the atomic layer deposition market report during the forecast period. The regions covered in the atomic layer deposition market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa