The extreme ultraviolet lithography market has seen considerable growth due to a variety of factors.
• The market size of extreme ultraviolet lithography has been expanding rapidly in the last few years. It is projected to surge from $4.96 billion in 2024 to about $6.1 billion in 2025, demonstrating a compound annual growth rate (CAGR) of 22.9%.
The historical growth can be credited to the rise in complexity and miniaturization of semiconductor devices, the requirement for greater precision and narrower line widths in semiconductor production, research and development investments in semiconductor fabrication technologies, the switch to more advanced nodes in semiconductor manufacturing (for instance, 7nm, 5nm, 3nm), and the essential need for improved efficiency and yield in semiconductor factories.
The extreme ultraviolet lithography market is expected to maintain its strong growth trajectory in upcoming years.
• The market for extreme ultraviolet lithography is projected to skyrocket in the coming years, swelling to a size of $14.53 billion by 2029, exhibiting a compound annual growth rate of 24.2%.
The growth projected during this period is primarily due to the increasing use of euv lithography in the fabrication of memory and logic devices, burgeoning market in growing economies and expanding semiconductor industries, a shift towards high-volume manufacturing using euv technology, and the application of AI and machine learning in semiconductor production. In the forecast period, the market trends to look out for include euv multi-patterning techniques, euv systems with high numerical apertures, advancements in euv mask technologies, protection of euv masks using euv pellicles, solutions for euv metrology and inspection, and highly productive euv systems for manufacturing.
The surging necessity for smartphones is anticipated to propel the demand for the extreme ultraviolet lithography market. Characterized as an innovative technology, Extreme Ultraviolet Lithography (EUVL) is utilized in the development of superior microprocessors compared to conventional ones, primarily designed for smartphones and personal computers. This EUV lithography technology offers a simplistic approach to building compact electronic chips with the benefit of decreased intricacy, lessened cost, and reduced power necessities. As an example, a recent March 2022 publication by Cybercrew, an association of tech-enthusiasts based in the UK who are engaged in computer, mobile phone, and gaming work, disclosed that around 87% of adults owned smartphones in 2020. Additionally, the UK secured the second rank with a global smartphone penetration rate of 78.9%. Owing to this, the escalating demand for enhanced smartphones generates a greater need for EUV lithography. This in turn aids chip manufacturers to create faster, smaller, and more potent chips.
The extreme ultraviolet lithography market covered in this report is segmented –
1) By Equipment: Light Source, Mirrors, Mask, Other Equipment
2) By Light Source: Laser-produced Plasma, Gas Discharge, Vacuum Sparks
3) By End User: Integrated Device Manufacturers (IDM), Foundry, Other End-Users
Subsegments:
1) By Light Source: Laser-Produced Plasma (LPP) Sources, Gas Discharge Plasma (GDP) Sources
2) By Mirrors: Reflective Mirrors, Multilayer Mirrors
3) By Mask: Masks For Patterning, Masks For Etching
4) By Other Equipment: Photomask Inspection Tools, Wafer Handling Equipment, Lithography Alignment Systems
The extraordinary cost of extreme ultraviolet lithography systems could potentially limit the expansion of the extreme ultraviolet lithography market. A lithography machine is a core instrument in chip fabrication. ASML is the sole producer of sophisticated high-end lithography machines dedicated to cutting intricate chips. Constructed from over 100,000 components, the extreme ultraviolet lithography machine carries a hefty price tag of around $120 million. Consequently, this significant cost is likely to act as a barrier to the growth of the extreme ultraviolet lithography market.
Major companies operating in the extreme ultraviolet lithography market include:
• ASML Holding
• Intel Corporation
• Samsung Electronics
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Nikon Corporation
• Canon Inc.
• Applied Materials Inc.
• Lam Research Corporation
• KLA Corporation
• Tokyo Electron Limited
• Micron Technology Inc.
• SK Hynix Inc.
• IBM Corporation
• Broadcom Inc.
• Qualcomm Inc.
• Infineon Technologies AG
• Renesas Electronics Corporation
• Advanced Micro Devices (AMD)
• Semiconductor Manufacturing International Corporation (SMIC)
• Aixtron SE
• Rudolph Technologies
• Onto Innovation Inc.
• Ultratech Inc.
• Veeco Instruments Inc.
Asia-Pacific was the largest region in the extreme ultraviolet lithography market in 2024. North America was the second largest region in the electrical and electronics market during the forecast period. The regions covered in the extreme ultraviolet lithography market report include Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.