The polyamide hot melt adhesives market has seen considerable growth due to a variety of factors.
• In the past few years, there has been a robust expansion of the polyamide hot melt adhesives market. This sector is forecasted to progress from a valuation of $0.63 billion in 2024 to $0.67 billion in 2025, reflecting a compound annual growth rate (CAGR) of 6.4%.
The development during the historical period has been facilitated by factors such as enhanced chemical endurance, advancements in the automotive industry, an increase in footwear production, a surge in global manufacturing, and the expansion of sustainable packaging.
The polyamide hot melt adhesives market is expected to maintain its strong growth trajectory in upcoming years.
• There is a forecast of robust expansion in the polyamide hot melt adhesives market over the ensuing years, with an expected rise to $0.84 billion in 2029, boasting a compound annual growth rate (CAGR) of 6.1%.
This surge in the projected timeline can be credited to the expansion of the packaging sector, attention to lightweight materials in aerospace, escalating demands for electric vehicles, and increased utilization in electronics. Dominant trends during this forecast period comprise improvements in manufacturing technologies, advances in 5G and electronics, progress in packaging technologies, cooperation with circular economy strategies, and innovation catered to specific applications.
The polyamide hot melt adhesives market is predicted to experience growth due to the rising demand for consumer electronics. These are electronic devices designed for day-to-day use by individuals. The use of consumer electronics demonstrates the progression towards cutting-edge technology, enhanced internet accessibility, the distribution of smart devices, and improved connectivity to meet varied consumer needs and preferences. Polyamide hot melt adhesives offer superior thermal stability, exceptional electrical insulation, and robust and enduring bonds that can bear mechanical stress and changes in temperature, ensuring dependable and long-lasting component assemblies. For example, the Japan Electronics and Information Technology Industries Association, a trade association based in Japan, reported that the total production of electronic equipment in the country reached 771,457 units in May 2023. Furthermore, the production of consumer electronics reached 32,099 units in May 2023, up from 25,268 units in May 2022. Therefore, the growing demand for consumer electronics is fuelling the advancement of the polyamide hot melt adhesives market.
The polyamide hot melt adhesivesmarket covered in this report is segmented –
1) By Type: Granules, Powder, Other Types
2) By Form: Thermosetting, Thermoplastic
3) By Application: Shoes And Textile, Automotive, Electrical, Woodworking, Other Applications
Subsegments:
1) By Granules: Low Viscosity Granules, High Viscosity Granules, Recycled Granules
2) By Powder: Fine Powder, Coarse Powder, Specialty Powder
3) By Other Types: Liquid Adhesives, Films And Sheets, Emulsions
Key players in the polyamide hot melt adhesives market are innovating hot melt label adhesive solutions to enhance longevity, efficacy, and adaptability for diverse labeling tasks. Hot melt label adhesive solutions, activated by heat, are commonly used in labeling processes. For example, in April 2023, Avery Dennison and Dow, a US-based firm specializing in materials science and digital identification systems, introduced a pioneering hot melt label adhesive to boost packaging recyclability. This cutting-edge adhesive enables mechanical recycling of polyolefin filmic labels and polypropylene (PP) or polyethylene (PE) packaging within one stream, effectively handling them as a single material. The market's first olefinic hotmelt adhesive specifically made for chilled food applications was launched. This adhesive acquired Recyclass approval for recycling in the high density polyethylene (HDPE) coloured stream in European markets.
Major companies operating in the polyamide hot melt adhesives market are:
• BASF SE
• 3M Company
• Henkel AG And Co. KGaA
• Evonik Industries
• Dow Chemical Company
• Sika AG
• Arkema S.A.
• Huntsman Corporation
• H.B. Fuller Company
• Bostik Inc.
• DuPont
• TEX YEAR INDUSTRIES INC.
• Beardow Adams Ltd.
• Shanghai Tianyang Hot Melt Adhesive Co. Ltd.
• Jowat SE
• Bühnen GmbH & Co. KG
• Palmetto Adhesives Company
• Schaetti
• Sipol
• Huate Bonding Material
• Shanghai Tianyang
• Bond Tech Industries
Asia-Pacific was the largest region in the polyamide hot melt adhesives market in 2024, and is expected to be the fastest-growing region in the forecast period. The regions covered in the polyamide hot melt adhesives market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.