The wafer processing equipment market has seen considerable growth due to a variety of factors.
• In recent times, the market size of wafer processing equipment has seen substantial growth. It's predicted to rise from $149.52 billion in 2024 to $159.71 billion in 2025, with a compound annual growth rate (CAGR) of 6.8%.
The expansion in the historic period can be ascribed to factors such as the rise in consumer electronics, industrial automation, iot, and economic conditions.
The wafer processing equipment market is expected to maintain its strong growth trajectory in upcoming years.
• The market size of wafer processing equipment is predicted to witness significant expansion in the upcoming years, escalating to a worth of $203.09 billion in 2029 with a 6.2% Compound Annual Growth Rate (CAGR). The projected growth during the forecast period can be linked to factors such as 5G technology, artificial intelligence (AI), electric vehicles (EVs), environmental concerns, and semiconductor shortages. Key trends shaping the forecast period consist of technological progress, research and development activities, integration of AI and machine learning, diminution and wafer size, and merger and acquisition activities.
The wafer processing equipment market is anticipated to experience increased growth due to the escalating demand for consumer electronic devices. The rising need for electronic goods has set higher customer expectations for advanced features in fresh electronic appliances. RFIDs are integrated with various consumer electronic and identification solutions, including smart cards, identification tags, and more, which use wafers to create integrated circuits. Customers are expressing an amplified demand for these ultra-smooth, thinner wafers for seamless integration into electronic gadgets. For instance, as per an October 2022 press announcement by Apple Inc., a firm rooted in the American consumer electronics landscape, the company noticed an 8% year-on-year boost in its September 2022 quarter record revenue, summing up to $90.1 billion, and a 4% year-on-year rise in quarterly earnings per diluted share, equating to $1.29. The year-on-year annual revenue rise for Apple was reported to be 8%, rounding up to $394.3 billion. Moreover, the increasing utilization and consumption of consumer electronic appliances are expected to induce the demand for semiconductors, which is further expected to fuel revenues in the wafer processing equipment market over the forecast period.
The wafer processing equipment market covered in this report is segmented –
1) By Equipment Type: Oxidation Systems, Diffusion Systems, Epitaxial Reactors, Photolithography Equipment, Other Equipment Types
2) By Application: MEMS, RFID, CMOS Image Sensor, Other Applications
3) By End Use: Medical, Military, Solar, Industrial, Other End Uses
Subsegments:
1) By Oxidation Systems: Dry Oxidation Systems, Wet Oxidation Systems
2) By Diffusion Systems: Batch Diffusion Systems, Single Wafer Diffusion Systems
3) By Epitaxial Reactors: Vertical Epitaxial Reactors, Horizontal Epitaxial Reactors
4) By Photolithography Equipment: Mask Aligners, Step and Repeat Systems, Stepper Systems, Scanners
5) By Other Equipment Types: Chemical Vapor Deposition (CVD) Equipment, Physical Vapor Deposition (PVD) Equipment, Etching Equipment, Ion Implantation Equipment
The rising need for miniaturized wafers that upgrade device performance is a key trend in the wafer processing equipment marketplace. Wafers, which are semiconductor substrates, are being slimmed down to a final thickness of a few tens of micrometers. Majority of the semiconductor wafers used in memory, CIS and power applications are generally chiselled down to 100 µm-200 µm. Further thinning is required in the context of memory devices in order to increase single-package memory capacity, enhance data transfer rates, and optimize power consumption, mainly driven by mobile applications. Conventional memory devices like 2D NAND/DRAM employ silicon wafers that are over 200 µm thick. By the year 2025, it is projected that the thickness of 3D stacked DRAM will continue to be reduced from 50 µm - 30 µm thick silicon substrates. Currently, BSI CIS wafers, with a thickness of less than 10 µm, are the thinnest wafers used in all applications. Therefore, the trend of using ultra-smooth and thinner wafers for device integration has been steadily increasing in recent years.
Major companies operating in the wafer processing equipment market include:
• Lam Research Corporation
• Tokyo Electron Limited
• Applied Materials Inc.
• SPTS Technologies Limited
• Plasma-Therm LLC
• Disco Corporation
• Tokyo Seimitsu Co. Ltd.
• KLA-Tencor Corporation
• Hitachi Kokusai Electronic Inc.
• Taiwan Semiconductor Manufacturing Company Limited
• Nikon Corporation
• Samsung Electronics Co. Ltd.
• SCREEN Semiconductor Solutions Co. Ltd.
• EV Group
• Advantest Corporation
• ASML Holding NV
• KLA Corporation
• Canon Inc.
• Axcelis Technologies Inc.
• Teradyne Inc.
• Kokusai Electric Corp.
• ASM International NV
• ATS Automation Tooling Systems Inc.
• Tokyo Electron Limited
• Screen Holdings Co. Ltd.
• Onto Innovation Inc.
• Veeco Instruments Inc.
• Mattson Technology Inc.
• Aixtron SE
• Nordson Corporation
Asia-Pacific was the largest region in the wafer processing equipment market in 2023. Western Europe was the second-largest region in the wafer processing equipment market. The regions covered in the wafer processing equipment market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa