The three-dimensional (3D) integrated circuit (IC) market has seen rapid growth, expanding from $10.73 billion in 2023 to $12.41 billion in 2024, with a compound annual growth rate (CAGR) of 15.7%. This increase is attributed to heightened demand for advanced electronic products, a rising need for improved energy efficiency, and growing demand for higher-performance electronics. The market is anticipated to continue its rapid growth, reaching $22.33 billion by 2028, at a CAGR of 15.8%. This forecasted growth is driven by a surge in demand for smart devices and sophisticated integrations, increased investment in research and development, a rising need for 3D ICs in sectors such as servers, data hubs, and the military and aerospace sectors, and the expansion of semiconductor industries alongside IoT and AI technologies. Major trends in the forecast period include the constant need for device miniaturization, the use of advanced packaging technologies, heterogeneous integration of devices, a focus on sustainability and energy efficiency, customization of 3D IC solutions for specific applications, the development of new materials for improved performance and efficiency, and enhanced manufacturing processes aimed at cost reduction.
Global Three Dimensional 3D Integrated Circuits IC Market Key Driver
The expansion of the semiconductor industry is expected to drive the growth of the three-dimensional (3D) integrated circuit (IC) market. The semiconductor industry, which designs, manufactures, and sells semiconductor devices used in various electronic products, is growing due to the demand for consumer electronics and 5G network technologies. 3D ICs offer advantages such as enhanced performance, improved power efficiency, and space optimization. The Semiconductor Industry Association reported in July 2024 that global semiconductor industry sales reached $49.1 billion in May 2024, up 19.3% from May 2023. Consequently, the growth of the semiconductor industry is propelling the three-dimensional (3D) integrated circuit (IC) market.
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Global Three Dimensional 3D Integrated Circuits IC Market Segments
The three dimensional (3D) integrated circuits (IC) market covered in this report is segmented –
1) By Components: Through Glass Vias (TGVs), Through Silicon Vias (TSVs), Other Components
2) By Technology: 3D Stacked Integrated Circuit (ICs), Monolithic 3D Integrated Circuit (ICs), Integration And Packaging Type
3) By Application: Aerospace And Industrial, Telecommunication And Information Technology (IT), Automotive, Consumer Electronics, Medical, Industrial, Other Applications
By Geography:The regions covered in the three dimensional (3D) integrated circuits (IC) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
North America was the largest region in the three dimensional (3D) integrated circuit (IC) market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period.
Major Three Dimensional 3D Integrated Circuits IC Industry Players
Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, International Business Machines Corporation, Qualcomm Incorporated, SK Hynix Inc., Broadcom Inc., Micron Technology Inc., NVIDIA Corporation, Toshiba Corporation, Advanced Micro Devices Inc. (AMD), ASML Holding N.V., Texas Instruments Incorporated, MediaTek Inc., STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, ON Semiconductor Corporation, GlobalFoundries Inc., Microchip Technology Incorporated, Marvell Technology Group Ltd., JCET Group, Xilinx Inc., Silicon Labs Inc., Rambus Inc.
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Three Dimensional 3D Integrated Circuits IC Market Overview
Three-dimensional (3D) integrated circuits (ICs) refer to semiconductor devices where multiple layers of integrated circuits are stacked vertically to form a single, compact package. This stacking of layers allows for higher integration density, improved performance, and reduced footprint compared to traditional two-dimensional (2D) ICs.
Three Dimensional 3D Integrated Circuits IC Global Market Report 2023 provides data on the global three dimensional 3d integrated circuits ic market such as market size, growth forecasts, segments and geographies, competitive landscape including leading competitors’ revenues, profiles and market shares. The three dimensional 3d integrated circuits ic market report identifies opportunities and strategies based on market trends and leading competitors’ approaches.
