What Has Been the Growth of the Three Dimensional (3D) Integrated Circuits (IC) Market So Far?
The three dimensional (3d) integrated circuits (ic) market has seen considerable growth due to a variety of factors.
• The three-dimensional (3D) integrated circuits (IC) market has grown rapidly in recent years, forecast to increase from $12.41 billion in 2024 to $14.41 billion in 2025, at a CAGR of 16.1%.
Growth is driven by rising demand for advanced electronics, energy efficiency improvements, and the need for higher-performance electronic devices.
What Is the Forecasted Market Size and Growth Rate for The Three Dimensional (3D) Integrated Circuits (IC) Market Size In The Coming Years?
The three dimensional (3d) integrated circuits (ic) market is expected to maintain its strong growth trajectory in upcoming years.
• The three-dimensional (3D) integrated circuits (IC) market is expected to grow rapidly to $25.83 billion by 2029 with a CAGR of 15.7%.
Growth drivers include the rise of smart devices, increased investment in R&D, the need for 3D ICs in sectors like servers, data hubs, military, aerospace, and expanding IoT and AI technologies. Trends include miniaturization, advanced packaging technologies, heterogeneous device integration, energy efficiency, and the use of new materials for improved performance.
What Factors Are Driving Growth In The Three Dimensional (3D) Integrated Circuits (IC) Market?
The expansion of the semiconductor sector is anticipated to boost the progress of the three-dimensional (3D) integrated circuit (IC) market. This sector comprises firms that are involved in the creation, production, and sale of semiconductor devices, which are fundamental elements in various electronic goods such as computers, mobile phones, and industrial equipment. Considerable progress has been made in the semiconductor sector due to the widespread use of consumer electronics, including mobile phones, tablets, and wearable devices, which has resulted in an increased demand for sophisticated semiconductor components. Furthermore, new semiconductor technologies are required for enhanced communication, superior data transfer, and improved connectivity as part of the 5G network rollout. 3D ICs present multiple benefits for semiconductor applications, among them better performance, improved power efficiency, space efficiency, and effective thermal management. In May 2024, the Semiconductor Industry Association (SIA), noted that the worldwide semiconductor sector achieved sales of $49.1 billion, marking a 19.3% rise from the total of $41.2 billion in May 2023 and a 4.1% rise from the total of $47.2 billion in April 2024. Hence, the escalating demand within the semiconductor industries is driving the development of the three-dimensional (3D) integrated circuit (IC) market.
What Are The Main Segments Of The Global Three Dimensional (3D) Integrated Circuits (IC) Market?
The three dimensional (3D) integrated circuits (IC) market covered in this report is segmented –
1) By Components: Through Glass Vias (TGVs), Through Silicon Vias (TSVs), Other Components
2) By Technology: 3D Stacked Integrated Circuit (ICs), Monolithic 3D Integrated Circuit (ICs), Integration And Packaging Type
3) By Application: Aerospace And Industrial, Telecommunication And Information Technology (IT), Automotive, Consumer Electronics, Medical, Industrial, Other Applications
Subsegments:
1) By Through Glass Vias (TGVs): Glass Substrate For 3D ICs, TGV Fabrication Process, TGV Interconnects, High-Performance Glass For IC Packaging
2) By Through Silicon Vias (TSVs): Silicon Wafer For TSV Fabrication, TSV Interconnects and Via Formation, Copper TSVs, TSV Packaging Solutions, High-Density Tsvs For 3D ICs
3) By Other Components: Microbumps, Interposers, Microelectromechanical Systems (MEMS), Passive Components (Resistors, Capacitors), Thermal Management Components, Power Delivery Network (PDN) Components, Wafer Bonding Materials, Test And Inspection Components
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What Trends Are Shaping The Three Dimensional (3D) Integrated Circuits (IC) Market?
Leading firms in the Three-Dimensional (3D) Integrated Circuits (IC) market are concentrating their efforts on creating bespoke 3D ICs, specifically designed for certain applications or client needs such as 5G radio frequency performance, in order to maintain a competitive edge, meet precise market demands, and increase their revenue through specialized solutions. By integrating numerous high-speed components into a single package, 3D IC technology augments 5G, enhances performance, minimizes latency, and enables more streamlined and productive network infrastructure and devices. For example, United Microelectronics Corporation, a multinational corporation and semiconductor firm from Taiwan, debuted the industry's first 3D IC solution for radio frequency silicon on insulator (RFSOI) technology in May 2024, bringing about a significant progress in the 5G era. This revolutionary technology, supported on UMC’s 55nm RFSOI platform, diminishes circuit footprint by more than 45%, permitting the integration of additional RF components into 5G devices. This groundbreaking 3D IC solution tackles the issue of radio frequency (RF) interference, paving the way for upcoming developments in 5G millimeter-wave (mmWave) technology.
Who Are the Key Players In The Three Dimensional (3D) Integrated Circuits (IC) Market?
Major companies operating in the three dimensional (3D) integrated circuits (IC) market are:
• Samsung Electronics Co. Ltd.
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Intel Corporation
• International Business Machines Corporation
• Qualcomm Incorporated
• SK Hynix Inc.
• Broadcom Inc.
• Micron Technology Inc.
• NVIDIA Corporation
• Toshiba Corporation
• Advanced Micro Devices Inc. (AMD)
• ASML Holding N.V.
• Texas Instruments Incorporated
• MediaTek Inc.
• STMicroelectronics N.V.
• Infineon Technologies AG
• NXP Semiconductors N.V.
• Analog Devices Inc.
• Renesas Electronics Corporation
• United Microelectronics Corporation
• ON Semiconductor Corporation
• GlobalFoundries Inc.
• Microchip Technology Incorporated
• Marvell Technology Group Ltd.
• JCET Group
• Xilinx Inc.
• Silicon Labs Inc.
• Rambus Inc.
What Is The Most Dominant Region In The Three Dimensional (3D) Integrated Circuits (IC) Market?
North America was the largest region in the three dimensional (3D) integrated circuit (IC) market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the three dimensional (3D) integrated circuits (IC) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
